tsm9966dcx6 Taiwan Semiconductor Company, Ltd. (TSC), tsm9966dcx6 Datasheet

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tsm9966dcx6

Manufacturer Part Number
tsm9966dcx6
Description
20v Dual N-channel Mosfet
Manufacturer
Taiwan Semiconductor Company, Ltd. (TSC)
Datasheet

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
tsm9966dcx6 RFG
Manufacturer:
TSC/台半
Quantity:
20 000
Features
Application
Ordering Information
Absolute Maximum Rating
Thermal Performance
Notes:
a. Pulse width limited by the Maximum junction temperature
b. Surface Mounted on FR4 Board, t ≤ 5 sec.
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
Continuous Source Current (Diode Conduction)
Maximum Power Dissipation
Operating Junction Temperature
Operating Junction and Storage Temperature Range
Parameter
Junction to Case Thermal Resistance
Junction to Ambient Thermal Resistance (PCB mounted)
TSM9966DCX6 RF
Advance Trench Process Technology
High Density Cell Design for Ultra Low On-resistance
Specially Designed for Li-on Battery Packs
Battery Switch Application
Part No.
SOT-26
Package
Pin Definition:
1. Gate 1
2. Drain
3. Gate 2
SOT-26
(Ta = 25
3Kpcs / 7” Reel
6. Source 1
5. Drain
4. Source 2
Packing
o
C unless otherwise noted)
Ta = 25
Ta = 75
a,b
o
o
C
C
1/6
PRODUCT SUMMARY
V
DS
20
Symbol
Symbol
T
(V)
J
20V Dual N-Channel MOSFET
V
V
, T
I
P
T
I
DM
I
DS
GS
D
S
D
J
JC
JA
STG
Dual N-Channel MOSFET
Block Diagram
30 @ V
40 @ V
R
DS(on)
-55 to +150
GS
GS
Limit
Limit
+150
(mΩ)
±12
1.7
1.6
1.1
20
30
30
80
= 4.5V
= 2.5V
6
TSM9966D
Version: A07
I
D
o
o
Unit
Unit
6.0
5.2
C/W
C/W
o
o
W
(A)
V
V
A
A
A
C
C

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tsm9966dcx6 Summary of contents

Page 1

... High Density Cell Design for Ultra Low On-resistance Application ● Specially Designed for Li-on Battery Packs ● Battery Switch Application Ordering Information Part No. Package TSM9966DCX6 RF SOT-26 Absolute Maximum Rating Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Pulsed Drain Current Continuous Source Current (Diode Conduction) ...

Page 2

Electrical Specifications ( Parameter Static Drain-Source Breakdown Voltage Gate Threshold Voltage Gate Body Leakage Zero Gate Voltage Drain Current On-State Drain Current Drain-Source On-State Resistance Forward Transconductance Diode Forward Voltage b Dynamic Total Gate Charge Gate-Source Charge Gate-Drain ...

Page 3

Electrical Characteristics Curve Output Characteristics On-Resistance vs. Drain Current On-Resistance vs. Junction Temperature 20V Dual N-Channel MOSFET o ( unless otherwise noted) Source-Drain Diode Forward Voltage 3/6 TSM9966D Transfer Characteristics Gate Charge Version: A07 ...

Page 4

Electrical Characteristics Curve On-Resistance vs. Gate-Source Voltage Single Pulse Power Normalized Thermal Transient Impedance, Junction-to-Ambient 20V Dual N-Channel MOSFET o ( unless otherwise noted) 4/6 TSM9966D Threshold Voltage Version: A07 ...

Page 5

Marking Diagram SOT-26 Mechanical Drawing DIM Device Code Y = Year Code M = Month Code (A=Jan, B=Feb, C=Mar, D=Apl, E=May, F=Jun, G=Jul, H=Aug, I=Sep, J=Oct, K=Nov, ...

Page 6

Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No ...

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