bcm2070 Broadcom Corp., bcm2070 Datasheet

bcm2070

Manufacturer Part Number

bcm2070

Description

Bcm2070 - Single-chip Bluetooth 2.1 Edr Hci Solution

Manufacturer

Broadcom Corp.

Datasheet

1.BCM2070.pdf (2 pages)

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Download datasheet (208Kb)

•

Processed with 65-nm LP CMOS technology

Built-in power amplifier to support class 1 transmit output power

Fully integrated balun and T/R switch eliminate all external RF

matching components for class 1, 2, and 3 designs

Fully supports the Bluetooth 1.1, 1.2, 2.0, and 2.1 standards

including 1-, 2-, and 3-Mbps EDR operation

Lowest current consumption in all modes of operation

ROM-based solution to eliminate external flash and/or

EEPROM memory

Highest available Bluetooth radio performance of any single-

chip solution

• -90 dBm typical receiver sensitivity

• Programmable output power up to +12 dBm at 1.8V supply

Minimized external BOM requirements with less than 10

external passive components

Flexible set of interfaces that include up to 4 Mbps UART, USB,

H4, H5, USB, SDIO, I

Fractional-N frequency synthesizer supports any crystal or

TCXO source from 12 MHz to 40 MHz

Automatic calibration and frequency detection of crystal

frequency

Supports applications with WLAN and WiMAX coexistence

Proprietary packet redistribution scheme allowing up to five

headsets simultaneous A2DP music streaming

Supports wideband speech and packet-loss concealment for

superior voice quality

Voice Codec

Baseband

LPO Clock

Handset

TCXO

BLUETOOTH

Typical Cell Phone Application

F E A T U R E S

XTAL_PD/PU

HOST_WAKE

LPO_INPUT

BT_WAKE

XTAL_IN

UART

PCM

C, and serial/parallel flash

BCM2070

2.1 + EDR SINGLE-CHIP HCI SOLUTION

Coexistence

802.11

WLAN

WiMax

and

BCM2070

•

Host PC

Memory

Cellular and mobile communication devices

PDA and low-power embedded communication devices

PC and integration on PC motherboard applications

Package types available

• 50-pin fpBGA package (4.5 mm x 4 mm)

• 42-bump wafer-level BGA (WLBGA) package

Smallest packages, lowest power consumption, and highest

performance Bluetooth

Maximizes range and simplifies system integration by

providing exceptional output power and receiver sensitivity

Unmatched integration tremendously simplifies board-level

design for easy implementation

Achieves smallest board area requirements with minimum

external BOM and smallest package size available today

• Standard PCB requirement is less than 35 mm

• WLBGA COB solutions are less than 20 mm

ROM-based solution with flexible and much improved code

patching to ensure fast and easy integration

On-chip voltage regulator lowers BOM requirements and

provides additional power savings capability

Minimized power dissipation over other solutions

• 40% savings in power compared to the previous generation of

Flash

products in standard telephony headset applications

S U M M A R Y O F B E N E F I T S

Parallel or Serial

Typical PC Application

A P P L I C A T I O N S

USB

2.1 + EDR solution

BCM2070

Coexistence

802.11

WLAN

WiMax

and

Related parts for bcm2070

bcm2070 Summary of contents

Page 1

... Memory 802.11 WLAN Coexistence and WiMax ® 2.1 + EDR solution products in standard telephony headset applications Typical PC Application USB BCM2070 Flash Parallel or Serial 2 2 802.11 WLAN Coexistence and WiMax ...

Page 2

... LP CMOS technology, the BCM2070 offers unmatched integrated solution with the smallest footprint and lowest cost of implementing a Bluetooth system. The use of the advanced 65-nm process enables the BCM2070 to achieve the lowest possible current consumption in all modes of operation. The BCM2070 has an architecture that has been designed to take advantage of the EDR standard ...

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