upa2794 Renesas Electronics Corporation., upa2794 Datasheet - Page 11

• Manufacturer Part Number: upa2794
• Description: Switching N- And P-channel Power Mos Fet
• Manufacturer: Renesas Electronics Corporation.

TAPE INFORMATION
MARKING INFORMATION
RECOMMENDED SOLDERING CONDITIONS
sales representative.
Caution Do not use different soldering methods together (except for partial heating).
The
Infrared reflow
Partial heating
There are two types (-E1, -E2) of taping depending on the direction of the device.
For soldering methods and conditions other than those recommended below, please contact an NEC Electronics
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Soldering Method
μ
PA2794GR should be soldered and mounted under the following recommended conditions.
Maximum temperature (Package's surface temperature): 260°C or below
Time at maximum temperature: 10 seconds or less
Time of temperature higher than 220°C: 60 seconds or less
Preheating time at 160 to 180°C: 60 to 120 seconds
Maximum number of reflow processes: 3 times
Maximum chlorine content of rosin flux (percentage mass): 0.2% or less
Maximum temperature (Pin temperature): 350°C or below
Time (per side of the device): 3 seconds or less
Maximum chlorine content of rosin flux: 0.2% (wt.) or less
Reel side
1 pin mark
−E1 TYPE
Data Sheet G18594EJ1V0DS
A2794
Pb-free plating marking
Soldering Conditions
−E2 TYPE
Lot code
Draw-out side
IR60-00-3
P350
μ
Condition Symbol
Recommended
PA2794GR
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