MC14069UBDR2G ON Semiconductor, MC14069UBDR2G Datasheet - Page 6

IC INVERTER HEX CMOS 14SOIC

MC14069UBDR2G

Manufacturer Part Number
MC14069UBDR2G
Description
IC INVERTER HEX CMOS 14SOIC
Manufacturer
ON Semiconductor
Series
4000Br
Datasheet

Specifications of MC14069UBDR2G

Logic Type
Inverter
Number Of Inputs
1
Number Of Circuits
6
Current - Output High, Low
3.75mA, 24mA
Voltage - Supply
3 V ~ 18 V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
14-SOIC (3.9mm Width), 14-SOL
Logic Family
MC140
High Level Output Current
- 4.2 mA
Low Level Output Current
4.2 mA
Propagation Delay Time
125 ns, 75 ns, 55 ns
Supply Voltage (max)
18 V
Supply Voltage (min)
3 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Operating Supply Voltage
3 V to 18 V
Logical Function
Inverter
Number Of Elements
6
Operating Supply Voltage (typ)
3.3/5/9/12/15V
Package Type
SOIC
Operating Temp Range
-55C to 125C
Pin Count
14
Quiescent Current
1uA
Technology
CMOS
Mounting
Surface Mount
Operating Temperature Classification
Military
Operating Supply Voltage (max)
18V
Operating Supply Voltage (min)
3V
Output Current
8.8mA
No. Of Inputs
1
Supply Voltage Range
3V To 18V
Logic Case Style
SOIC
No. Of Pins
14
Operating Temperature Range
-55°C To +125°C
Filter Terminals
SMD
Rohs Compliant
Yes
Family Type
4000 CMOS
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MC14069UBDR2GOS
MC14069UBDR2GOS
MC14069UBDR2GOSTR

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC14069UBDR2G
Quantity:
2 500
Part Number:
MC14069UBDR2G
Manufacturer:
ON Semiconductor
Quantity:
20 000
Part Number:
MC14069UBDR2G
Manufacturer:
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Quantity:
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Part Number:
MC14069UBDR2G
Quantity:
60 000
−T−
0.15 (0.006) T
0.15 (0.006) T
0.10 (0.004)
SEATING
PLANE
L
U
U
PIN 1
IDENT.
2X
D
S
S
L/2
C
14
1
0.36
G
14X
14X
*For additional information on our Pb−Free strategy and soldering
−V−
A
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
K
0.10 (0.004)
REF
8
7
SOLDERING FOOTPRINT*
M
−U−
PACKAGE DIMENSIONS
1
B
T
H
1.26
14X
U
http://onsemi.com
J J1
N
CASE 948G−01
S
N
TSSOP−14
DETAIL E
ISSUE B
V
7.06
S
DETAIL E
6
SECTION N−N
Ç Ç Ç
Ç Ç Ç
É É É
Ç Ç Ç
É É É
F
K1
K
0.25 (0.010)
M
DIMENSIONS: MILLIMETERS
−W−
NOTES:
0.65
PITCH
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
4. DIMENSION B DOES NOT INCLUDE
5. DIMENSION K DOES NOT INCLUDE
6. TERMINAL NUMBERS ARE SHOWN FOR
7. DIMENSION A AND B ARE TO BE
ANSI Y14.5M, 1982.
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
REFERENCE ONLY.
DETERMINED AT DATUM PLANE −W−.
DIM
K1
J1
A
B
C
D
G
H
K
M
F
J
L
MILLIMETERS
MIN
4.90
4.30
0.05
0.50
0.50
0.09
0.09
0.19
0.19
−−−
0
0.65 BSC
6.40 BSC
_
MAX
5.10
4.50
1.20
0.15
0.75
0.60
0.20
0.16
0.30
0.25
8
_
0.193
0.169
0.002
0.020
0.020
0.004
0.004
0.007
0.007
MIN
−−− 0.047
0.026 BSC
0.252 BSC
0
INCHES
_
0.200
0.177
0.006
0.030
0.024
0.008
0.006
0.012
0.010
MAX
8
_

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