upg173ta ETC-unknow, upg173ta Datasheet - Page 5

• Manufacturer Part Number: upg173ta
• Description: L-band Driver Amplifier
• Manufacturer: ETC-unknow

RECOMMENDED SOLDERING CONDITIONS
conditions than the recommended conditions are to be consulted with our sales representatives.
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
Infrared ray reflow
VPS
Wave Soldering
Pin part heating
This Product should be soldered in the following recommended conditions.
Note It is the storage days after opening a dry pack, the storage conditions are 25°C, less than 65%, RH.
Caution The combined use of soldering method is to be avoided (However, except the pin area heating
For details of recommended soldering conditions for surface mounting, refer to information document
Soldering process
method).
Package peak temperature: 235°C
Hour: within 30 s. (more than 210°C)
Time: 3 times, Limited days: no.
Package peak temperature: 215°C
Hour: within 40 s. (more than 200°C)
Time: 3 times, Limited days: no.
Soldering tub temperature: less than 260°C, Hour: within 10 s.
Time: 1 time, Limited days: no.
Pin area temperature: less than 300°C, Hour: within 3 s.
Limited days: no.
Note
Preliminary Data Sheet
Soldering conditions
Note
Note
Note
Other soldering methods and
Recommended condition
symbol
WS60-00-1
VP15-00-3
IR35-00-3
P P P P PG173TA
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