upg101p Renesas Electronics Corporation., upg101p Datasheet - Page 7

• Manufacturer Part Number: upg101p
• Description: Wide Band Amplifier Chips
• Manufacturer: Renesas Electronics Corporation.

RECOMMENDED CHIP ASSEMBLY CONDITIONS
Die Attachment
Bonding
QUALITY ASSURANCE (Refer to GET-30116)
1. 100 % Tests
2. Tests on Sampling Basis
3. WARRANTEE
these are handled properly and stored in the desicater with the flow of dry N
4. CAUTION
Atmosphere
Temperature
AuSn Preform
Base Material
Epoxy Die Attach is not recommended.
Machine
Wire
Temperature
Strength
Atmosphere
NEC has a responsibility of quality assurance for the products within 180 days after delivered to customers where
1-1 100 % DC and RF Probe
1-2 Visual Inspection
2-1 Bond Pull Tests (In case of recommended chip handling)
2-2 Tests in Standard Package
4-1 Take great care to prevent static electricity.
4-2 Be sure that Die Attach is performed in N
MIL-STD-883/Method 2010 Condition B
MIL-STD-883 Method 2011
5 samples/wafer and 20 points tested
Accept 0/Reject 1
Test the electrical characteristics of chips assembled into the standard package used for P PG100B and
P PG101B.
5 samples/wafer tested
DC and RF measurement Accept 1/Reject 2
: N
: 320 r5 °C
: 0.5 u 0.5 u 0.05
: CuW, Cu, KV
: TCB
: 30 P m diameter Au wire
: 260 r5 °C
: 31 r3 g
: N
* The hard solder such as AuSi or AuGe which has higher melting point than
* Other material should not be used.
* USB is not recommended
2
2
AuSn should not be used.
gas
gas
2
t
(mm), 2 pcs.
atmosphere.
2
gas.
P P P P PG100P, P P P P PG101P
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