cxm3529xr Sony Electronics, cxm3529xr Datasheet
cxm3529xr
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cxm3529xr Summary of contents
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... SP9T Antenna Switch for GSM/UMTS Dual Mode Description The CXM3529XR is SP9T antenna switch for GSM/UMTS dual mode. This IC has a 1.8V CMOS decoder. The Sony GaAs junction gate pHEMT (JPHEMT) MMIC process is used for low insertion loss and high linearity. (Applications: Quad Bands GSM and Triple Bands UMTS) ...
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Absolute Maximum Ratings ( ° Bias voltage Control voltage Input power max. [Tx1] Input power max. [Tx2] Input power max. [TRx1 Input power max. [Rx1 Operating temperature Storage temperature Maximum power dissipation ...
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Block Diagram SP9T Antenna Switch Ant RF Switch Ant TRx1 (Band I) TRx2 F17 TRx3 F19 Decoder Logic F1 F2 F14 F16 F5 F18 TRx1 TRx2 TRx3 Tx1 Tx2 Rx1 Rx2 Rx3 Rx4 ...
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Pin Configuration Truth Table Vctl State State Active Path Tx1 Tx2 Rx1 Rx2 5 L ...
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Electrical Characteristics Specification 1 ( 2.5V, Vctl = 1.5/0V) ° DD Item Symbol Insertion loss IL VSWR VSWR Harmonics* 2fo 3fo 2fo 3fo 2fo 3fo 2fo 3fo 2fo 3fo Inter modulation IMD2 product power in ...
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Item Symbol Switching time Ts Control current Ictl Supply current Idd Electrical Characteristics are measured with all RF ports terminated in 50Ω. Tx1 input power: 34dBm, 824 to 915MHz, Tx1 enabled *1 Tx2 input power: 32dBm, 1710 to 1910MHz, Tx2 ...
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Specification 1-Isolation ( 2.5V, Vctl = 1.5/0V) ° DD Item Symbol Active Isolation ISO Tx1 Tx2 TRx1 TRx2 Path Condition Isolation Tx1-Rx1 Tx1-Rx2 Tx1-Rx3 Tx1-Rx4 824 to 915MHz Tx1-TRx1 Tx1-TRx2 Tx1-TRx3 Tx1-Tx2 Tx1-Tx2 1648 to ...
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Item Symbol Active Isolation ISO TRx3 Electrical Characteristics are measured with all RF ports terminated in 50Ω. Path Condition Isolation TRx3-Rx1 TRx3-Rx2 TRx3-Rx3 TRx3-Rx4 824 to 849MHz TRx3-TRx1 TRx3-TRx2 TRx3-Tx1 TRx3-Tx2 TRx3-Rx1 TRx3-Rx2 TRx3-Rx3 TRx3-Rx4 1710 to 1910MHz TRx3-TRx1 TRx3-TRx2 ...
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Recommended Circuit Rx1 Rx2 Rx3 Rx4 *1: When the DC level of the connected device is GND or open block capacitors are required on the RF port. *2: DC levels of all RF ports are GND. *3: L1 ...
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Package Outline (Unit: mm) LEAD PLATING SPECIFICATIONS ITEM LEAD MATERIAL SOLDER COMPOSITION PLATING THICKNESS - 10 - SPEC. COPPER ALLOY Sn-Bi Bi:1-4wt% 5-18µm Sony Corporation ...