APTGT400DA60D3G_11 MICROSEMI [Microsemi Corporation], APTGT400DA60D3G_11 Datasheet - Page 3

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APTGT400DA60D3G_11

Manufacturer Part Number
APTGT400DA60D3G_11
Description
Boost chopper Trench + Field Stop IGBT3 Power Module
Manufacturer
MICROSEMI [Microsemi Corporation]
Datasheet
Thermal and package characteristics
Symbol Characteristic
D3 Package outline
Torque
V
R
T
Wt
T
T
ISOL
thJC
STG
C
J
Junction to Case Thermal Resistance
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz
Operating junction temperature range
Storage Temperature Range
Operating Case Temperature
Mounting torque
Package Weight
A
(dimensions in mm)
For terminals
www.microsemi.com
To Heatsink
APTGT400DA60D3G
Diode
IGBT
M6
M6
DÉTAIL A
4000
Min
-40
-40
-40
3
3
Typ
Max
0.12
0.20
175
125
125
350
5
5
°C/W
Unit
N.m
°C
V
g
3 - 5

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