EFD30-3F3-A250-S PHILIPS [NXP Semiconductors], EFD30-3F3-A250-S Datasheet - Page 3

• Manufacturer Part Number: EFD30-3F3-A250-S
• Description: EFD cores and accessories
• Manufacturer: PHILIPS [NXP Semiconductors]

Philips Components
Properties of core sets under power conditions
COIL FORMERS
General data
Winding data for EFD30 coil former with 12-pins
1997 Nov 21
handbook, full pagewidth
3C30
3C85
3C90
3F3
3F4
Coil former material
Pin material
Maximum operating temperature
Resistance to soldering heat
Solderability
GRADE
EFD cores and accessories
Dimensions in mm.
NUMBER OF
SECTIONS
12.5
max
3.6
1
PARAMETER
12
H = 250 A/m;
0
0.2
f = 25 kHz;
T = 100 C
B (mT) at
360
320
330
315
300
21.55
14.95
16.4
WINDING
25.2 max
(mm
AREA
15
52.3
5
0
0.2
0
0.15
0.15
0
2
)
B ˆ
f = 25 kHz;
T = 100 C
= 200 mT;
phenolformaldehyde (PF), glass-reinforced, flame retardant in accordance with
“UL 94V-0” ; UL file number E167521(M)
copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
180 C, “IEC 85” class H
“IEC 68-2-20” , Part 2, Test Tb, method 1B, 350 C, 3.5 s
“IEC 68-2-20” , Part 2, Test Ta, method 1: 235 C, 2 s
0.50
0.74
0.50
5.2
0.1
0
Fig.2 EFD30 coil former; 12-pins.
6.6
MINIMUM
WINDING
WIDTH
(mm)
20.1
0
0.1
f = 100 kHz;
B ˆ
T = 100 C
= 100 mT;
0.54
0.86
0.54
0.54
O
3
0.8
(20.1 min)
21.7
LENGTH OF
31.2 max
AVERAGE
CORE LOSS (W) at
27.5
TURN
(mm)
52.9
0
0.2
f = 400 kHz;
B ˆ
T = 100 C
SPECIFICATION
= 50 mT;
0.91
CSH-EFD30-1S-12P
B ˆ
T = 100 C
f = 1 Mz;
5
= 30 mT;
1.3
1.00
TYPE NUMBER
0.15
0
0.05
Product specification
MGC184
B ˆ
T = 100 C
f = 3 MHz;
EFD30
= 10 mT;
1.60
27.5