SD103ATW_10 FORMOSA [Formosa MS], SD103ATW_10 Datasheet - Page 6

• Manufacturer Part Number: SD103ATW_10
• Description: 175mA Surface Mount Small Signal Schottky Diode Array-40V
• Manufacturer: FORMOSA [Formosa MS]

PACKAGE
SOT-363
Suggested thermal profiles for soldering processes
Reel packing
Small Signal Schottky Diode Array
SD103ATW
TL
25
TP
1.Storage environment: Temperature=5
2.Reflow soldering of surface-mount devices
3.Reflow soldering
http://www.formosams.com/
TEL:[phone]
FAX:[phone]
REEL SIZE
Tsmin
7"
Average ramp-up rate(T
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t
Tsmax to T
-Ramp-upRate
Time maintained above:
-Temperature(T
-Time(t
Peak Temperature(T
Time within 5 C of actual Peak
Temperature(t
Ramp-down Rate
Time 25 C to Peak Temperature
Tsmax
REEL
(pcs)
3000
L
o
)
Profile Feature
L
Preheat
t25 C to Peak
o
COMPONENT
P
o
tS
)
SPACING
L
(m/m)
)
4.0
s
)
P
)
Time
Ramp-up
L
to T
30,000
(pcs)
BOX
o
P
C
)
~40
183*183*123
o
Page 6
C
INNER
(m/m)
Humidity=55%±25%
BOX
Tp
Ramp-down
(m/m)
REEL
DIA,
178
Soldering Condition
TL
255 C-0/+5 C
60~260sec
<3
60~120sec
<6 C/sec
10~30sec
<6minutes
382*262*387
<3 C/sec
CARTON
o
150 C
200 C
o
217 C
o
C
(m/m)
SIZE
o
/sec
o
o
o
Document ID
DS-22163Q
Critical Zone
o
TL to TP
Formosa MS
CARTON
Issued Date
2009/08/10
240,000
(pcs)
Revised Date
2010/03/10
GROSS WEIGHT
APPROX.
Revision
(kg)
9.50
B
Page.
7