FMS2017-000-EB FILTRONIC [Filtronic Compound Semiconductors], FMS2017-000-EB Datasheet - Page 2

• Manufacturer Part Number: FMS2017-000-EB
• Description: 2.4GHz DPDT GaAs Single-Band WLAN Switch
• Manufacturer: FILTRONIC [Filtronic Compound Semiconductors]

Absolute Maximum Ratings:
Note: Exceeding any one of these absolute maximum ratings may cause permanent damage to the
device.
Pad and Die Layout:
H
Note: Co-ordinates are referenced from the bottom left hand corner of the die to the centre of the
bond pad opening
E
Truth Table:
A
Die Size (µm)
Contact Details (USA): Tel: [phone]
Contact Details (UK):
930x600
State
Note:
1
2
3
4
5
6
Operating Temperature
D
B
Storage Temperature
Parameter
Max Input Power
Control Voltage
‘High’
‘Low’
Die Thickness (µm)
High
High
V1
Low
Low
Low
Low
Preliminary specifications subject to change without notice
Tel: [phone] Fax: [phone] Email: [e-mail]
= 0V to +0.2V
= +2.4V to +3.3V
Filtronic Compound Semiconductors Ltd
150
High
High
V2
Low
Low
Low
Low
Preliminary Data Sheet
C
F
G
Website: www.filcs.com
Symbol
Toper
Tstor
Vctrl
Pin
High
High
V3
Low
Low
Low
Low
Pad
2
Ref
Fax: [phone]
A
B
C
D
E
G
H
F
Min. Bond Pad
Pitch (µm)
Name
225
Absolute Maximum
High
High
V4
Low
Low
Low
Low
Pad
ANT1
ANT2
RX
TX
2.2
V1
V2
V3
V4
-40°C to +100°C
-55°C to +150°C
+36dBm
Description
+5V
Vctrl1 (A1 to RX)
Vctrl2 (A2 to RX)
Vctrl3 (TX to A2)
Vctrl4 (A1 to TX)
TX-ANT1 & RX-ANT2
TX-ANT2 & RX-ANT1
Antenna 1
Antenna 2
Transmit
Receive
Email: [e-mail]
PATH(S)
RX-ANT1
RX-ANT2
TX-ANT2
TX-ANT1
Min. Bond pad
opening (µm)
85x85
Pin Coordinates
FMS2017
(155, 300)
(775, 300)
(465, 510)
(775, 510)
(155, 510)
(465, 90)
(155, 90)
(775, 90)
(µm)