TS1220-X00B-TR STMICROELECTRONICS [STMicroelectronics], TS1220-X00B-TR Datasheet - Page 4

• Manufacturer Part Number: TS1220-X00B-TR
• Description: Sensitive and Standard 12 A SCRS
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

Characteristics
4/12
Figure 3.
Figure 5.
Figure 7.
3.0
2.5
2.0
1.5
1.0
0.5
0.0
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.00
0.10
0.01
-40
1E-2
I
0
I
GT H L
T(AV)
K=[Z
,I ,I [T ] /
-20
(A)
= 180°
th(j-a)
I
GT
Average and D.C. on-state current
versus ambient temperature
(device mounted on FR4 with
recommended pad layout) (DPAK)
Relative variation of thermal
impedance junction to ambient
versus pulse duration
(recommended pad layout, FR4 PC
board for DPAK)
Relative variation of gate trigger
current and holding current versus
junction temperature for TN12 and
TYNx12 series
j
25
/R
1E-1
DPAK
0
I
th(j-a)
GT H L
,I ,I [T =25°C]
D PAK
D.C.
2
20
]
50
1E+0
j
D PAK
T
40
2
T (°C)
amb
t (s)
j
p
DPAK
(°C)
60
75
1E+1
TO-220AB / IPAK
80
100
100
I
H
1E+2
& I
L
120
5E+2
125
140
Figure 4.
Figure 6.
Figure 8.
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.0
0.5
0.2
0.1
1E-2
1E-3
-40
I [R
I
K=[Z
H
GT H L
,I ,I [T ] /
GK
th(j-c)
-20
] / I [
H
Relative variation of thermal
impedance junction to case versus
pulse duration
Relative variation of gate trigger
current and holding current versus
junction temperature for TS12
series
Relative variation of holding
current versus gate-cathode
resistance (typical values) for TS12
series
j
/R
I
GT
R
th(j-c)
0
I
GK
GT H L
=1k ]
,I ,I [T =25°C]
1E-1
1E-2
TN12, TS12 and TYNx12 Series
]
20
j
R
40
T (°C)
GK
t (s)
j
p
(k )
60
1E+0
1E-1
80
R
GK
I
H
& I
= 1k
100
L
T
j
= 25°C
120
1E+0
1E+1
140