TS18H SUNTAN [Suntan Capacitors], TS18H Datasheet - Page 6

• Manufacturer Part Number: TS18H
• Description: HIGH VOLTAGE CERAMIC CHIP CAPACITOR-SMD
• Manufacturer: SUNTAN [Suntan Capacitors]

TS18H
HIGH VOLTAGE CERAMIC CHIP CAPACITOR-SMD
Precautions on the use of MLCC:
1.eneral Precautions On The Use Of MLCC:
2. PCB Design
3. Considerations For Automatic Placement
The Multi-layer Ceramic Capacitors MLCC may fail when subjected to severe conditions of electrical
environment and manchanical stress beyond the specified "rating" and specified condition in the
specification.Following the precautions for satefy .
The amount of solder applied can affect the ability of chips to withstand
mechanical stresses, which may lead to breaking or cracking. Therefore,
when designing land-patterns it is necessary to consider the appropriate
size and configuration of the solder pads, which determines the amount of
solder necessary to form the fillets.
When designing the position of solder pads and SMD capacitors,it
should be carefully performed to minimize stress.SMD capacitors should
be located to minimize any possible mechanical stresses from board warp
or deflection.
If the lower limit of the pick-up nozzle is low,too much force may be imposed on the capacitors, causing
damage. To avoid this, the following points should be considered before lowering the pick-up nozzle:
The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for
deflection of the board.
The pick-up pressure should be adjusted between 1 and 3 N static loads.
To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins of
back-up should be used the under PC board.
Suntan
®
Technology Company Limited
Website: www.suntan.com.hk
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Suntan
®