ilx585k Sony Electronics, ilx585k Datasheet - Page 18

• Manufacturer Part Number: ilx585k
• Description: Pixel 6line Ccd Linear Sensor Color
• Manufacturer: Sony Electronics

Notes of Handling
1) Static charge prevention
2) Notes on Handling CCD Packages
3) Soldering
Plastic portion
b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be
c) Be aware that any of the following can cause the package to crack or dust to be generated.
d) The notch of the plastic portion is used for directional index, and that can not be used for reference
a) Remain within the following limits when applying static load to the package:
CCD image sensors are easily damaged by static discharge. Before handling be sure to take the
following protective measures.
a) Either handle bare handed or use non chargeable gloves, clothes or material. Also use conductive
b) When handling directly use an earth band.
c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.
d) Ionized air is recommended for discharge when handling CCD image sensor.
e) For the shipment of mounted substrates, use boxes treated for prevention of static charges.
The following points should be observed when handling and installing packages.
a) Make sure the package temperature does not exceed 80°C.
b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a 30W soldering
c) To dismount an imaging device, do not use a solder suction equipment. When using an electric
Ceramic portion
shoes.
(1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter
(2) Shearing strength: 29N/surface
(3) Tensile strength: 29N/surface
(4) Torsional strength: 0.9Nm
generated and the package may fracture, etc., depending on the flatness of the ceramic portion.
Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive.
(1) Applying repetitive bending stress to the external leads.
(2) Applying heat to the external leads for an extended period of time with soldering iron.
(3) Rapid cooling or heating.
(4) Prying the plastic portion and ceramic portion away at a support point of the adhesive layer.
(5) Applying the metal a crash or a rub against the plastic portion.
Note that the preceding notes should also be observed when removing a component from a board
after it has already been soldered.
of fixing. In addition, the cover glass and seal resin may overlap with the notch or ceramic may
overlap with the notch of the plastic portion.
iron with a ground wire and solder each pin in less then 2 seconds. For repairs and remount, cool
sufficiently.
desoldering tool, ground the controller. For the control system, use a zero cross type.
Cover glass
of the glass portion.)
(1)
39N
Adhesive
29N
(2)
18
(3)
29N
(4)
02.07.30
ILX585K
0.9Nm