S12ATD10B8CV2 MOTOROLA [Motorola, Inc], S12ATD10B8CV2 Datasheet - Page 101

• Manufacturer Part Number: S12ATD10B8CV2
• Description: MC9S12DT128 Device User Guide V02.09
• Manufacturer: MOTOROLA [Motorola, Inc]

A.1.8 Power Dissipation and Thermal Characteristics
Power dissipation and thermal characteristics are closely related. The user must assure that the maximum
operating junction temperature is not exceeded. The average chip-junction temperature (T
obtained from:
T J
I/O, Regulator and Analog Supply Voltage
Digital Logic Supply Voltage
PLL Supply Voltage
Voltage Difference VDDX to VDDR and VDDA
Voltage Difference VSSX to VSSR and VSSA
Oscillator
Bus Frequency
MC9S12DT128C
MC9S12DT128V
MC9S12DT128M
=
NOTES:
1. The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply. The
2. Some blocks e.g. ATD (conversion) and NVMs (program/erase) require higher bus frequencies for proper oper-
3. Please refer to Section A.1.8 Power Dissipation and Thermal Characteristics for more details about the rela-
Junction Temperature, [ C
given operating range applies when this regulator is disabled and the device is powered from an external source.
ation.
tion between ambient temperature T
Operating Ambient Temperature Range
Operating Ambient Temperature Range
Operating Ambient Temperature Range
calculations refer to Section A.1.8 Power Dissipation and Thermal
Characteristics.
Operating Junction Temperature Range
Operating Junction Temperature Range
Operating Junction Temperature Range
1
Rating
1
Table A-4 Operating Conditions
A
and device junction temperature T
T J
=
T A
3
3
3
+
Symbol
V
V
DDPLL
V
VDDX
VSSX
f
f
P D
osc
bus
T
T
T
T
T
T
DD5
DD
A
A
A
J
J
J
JA
MC9S12DT128 Device User Guide — V02.09
0.25
Min
2.35
2.25
-0.1
-0.1
4.5
0.5
-40
-40
-40
-40
-40
-40
2
J
.
Typ
2.5
2.5
27
27
27
5
0
0
-
-
-
-
-
Max
5.25
2.75
2.75
100
120
105
140
125
0.1
0.1
16
25
85
J
) in C can be
Unit
MHz
MHz
V
V
V
V
V
C
C
C
C
C
C
101