SSC-FR104 SEOUL [Seoul Semiconductor], SSC-FR104 Datasheet - Page 4

• Manufacturer Part Number: SSC-FR104
• Description: CHIP LED DEVICE
• Manufacturer: SEOUL [Seoul Semiconductor]

SSC-QP-0401-06(REV.0)
5. Soldering Profile
(1) Reflow Soldering Conditions / Profile
(2) Reflow Soldering Conditions /Lead-Free Solder
(3) Hand Soldering conditions
[Note] In case the soldered products are reused in soldering process, we don’t guarantee the products.
Preliminary heating to be at 150℃max. for 2 minutes max.
Soldering heat to be at 230 ± 5℃max. for 5 seconds max.
Preliminary heating to be at 150℃max. for 2 minutes max.
Soldering heat to be at 255℃(+5/-0)℃max. for 10 seconds max.
Not more than 3 seconds @MAX280℃, under Soldering iron.
255
150
120
(+5)
°C
230
150
120
°C
0
0
Pre-heating
Pre-heating
60 to 120 sec.
60 to 120 sec.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: [phone] FAX: [phone]
SEOUL SEMICONDUCTOR CO,. LTD.
Temperature
rise: 5°C/sec.
Temperature
rise: 5°C/sec.
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Operation heating
Operation heating
5sec. max
5 to 10 sec.
Relative Spectral Emission
-5°C/sec.
Cooling:
-5°C/sec.
Cooling:
SSC-FR104-II1