SSC-SFT821N-BS SEOUL [Seoul Semiconductor], SSC-SFT821N-BS Datasheet - Page 7

no-image

SSC-SFT821N-BS

Manufacturer Part Number
SSC-SFT821N-BS
Description
Top View LED
Manufacturer
SEOUL [Seoul Semiconductor]
Datasheet
SSC-QP-7-03-08(REV.00)
[°C]
Temp
180
150
260
240
220
200
0
7. Soldering Profile
(1) Reflow Soldering Conditions / Profile (Lead Free Solder)
(2) Hand Soldering conditions
(3) The encapsulated material of the LEDs is silicone.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
Precautions should be taken to avoid the strong pressure on the encapsulated part.
So when using the chip mounter, the picking up nozzle that does not affect the silicone
resign should be used.
Pre-heating
148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Rising
5 °C/sec
SEOUL SEMICONDUCTOR CO., LTD.
Phone : 82-2-2106-7305~6
- 7/14 -
Tm : Reflow machine setting temp (max 30 sec.)
Ts : Surface temp of PCB (max)
Ts : Surface temp of PCB (recommend)
Ts : Surface temp of PCB (min)
Cooling
-5 °C/sec
[Hr]
Time
SSC-SFT821N-S

Related parts for SSC-SFT821N-BS