la73b-1-hxx-pf Ligitek Electronics Co., Ltd., la73b-1-hxx-pf Datasheet - Page 5

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la73b-1-hxx-pf

Manufacturer Part Number
la73b-1-hxx-pf
Description
Led Array
Manufacturer
Ligitek Electronics Co., Ltd.
Datasheet
PART NO.
1.Iron:
Soldering Condition(Pb-Free)
Note: 1.Wave solder should not be made more than one time.
2.Wave Soldering Profile
Dip Soldering
Preheat: 120° C Max
Preheat time: 60seconds Max
Ramp-up
Ramp-Down:-5° C/sec(max)
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to case)
Soldering Time:3 Seconds Max(One time only)
2°C/sec(max)
Solder Bath:260°C Max
Soldering Iron:30W Max
Temperature 350 ° C Max
Distance:2mm Min(From solder joint to case)
2.You can just only select one of the soldering conditions as above.
Temp(°C)
LA73B-1/HXX-PF
120°
260°
25°
0
60 Seconds Max
Preheat
2° /sec
max
50
LIGITEK ELECTRONICS CO.,LTD.
260°C3sec Max
Property of Ligitek Only
5°/sec
max
100
Time(sec)
150
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