cxp81952 Sony Electronics, cxp81952 Datasheet - Page 27

• Manufacturer Part Number: cxp81952
• Description: Cmos 8-bit Single Chip Microcomputer
• Manufacturer: Sony Electronics

Package Outline
Unit: mm
0.5 ± 0.08
SONY CODE
JEDEC CODE
EIAJ CODE
100
SONY CODE
EIAJ CODE
JEDEC CODE
76
1
75
0.65
0° to 15°
0° to 10°
0.1 ± 0.1
DETAIL A
0.18 – 0.03
LQFP-100P-L01
QFP100-P-1414-A
16.0 ± 0.2
14.0 ± 0.1
DETAIL A
QFP-100P-L01
23.9 ± 0.4
20.0 – 0.1
QFP100-P-1420-A
+ 0.08
+ 0.4
100PIN LQFP (PLASTIC)
100PIN QFP (PLASTIC)
±0.12
51
25
0.15
– 27 –
M
NOTE: Dimension “ ” does not include mold protrusion.
50
26
(0.22)
PACKAGE MATERIAL
LEAD MATERIAL
PACKAGE STRUCTURE
LEAD TREATMENT
PACKAGE WEIGHT
PACKAGE STRUCTURE
PACKAGE MATERIAL
PACKAGE WEIGHT
LEAD MATERIAL
LEAD TREATMENT
1.5 – 0.1
+ 0.2
A
0.15 – 0.05
+ 0.1
0.127 – 0.02
EPOXY/PHENOL RESIN
SOLDER PLATING
42 ALLOY
EPOXY RESIN
SOLDER PLATING
1.4g
COPPER / 42 ALLOY
+ 0.05
2.75 – 0.15
A
+ 0.35
0.1
CXP81952/81960