ERBSD0R25U PANASONIC [Panasonic Semiconductor], ERBSD0R25U Datasheet - Page 3

• Manufacturer Part Number: ERBSD0R25U
• Description: Micro Chip Fuse
• Manufacturer: PANASONIC [Panasonic Semiconductor]

■
● I–t Characteristics
● I
■
● Standard Quantity
● Punched Carrier Taping
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Dimen
Dimen
sions
(mm)
sions
(mm)
Fusing Characteristics (25 °C typical)
Packaging Methods
0.0001
0.0001
2
0.001
0.001
t–t Characteristics
0.01
0.01
100
0.1
0.1
● Type ERBSE
● Type ERBSE
10
T
10
ERBSE
ERBSD
ERBSE
ERBSD 2.00
0.0001
1
1
ERBSE
ERBSD
Type
0.1
Type
Chip component
Type
✽ Reference Only
Sprocket hole
4.00
1.00
0.65
0.001
P
A
A
φD
1
±0.10
±0.10
±0.10
±0.05
0
1
P
2.00
Compartment
1.80
1.15
1
Fusing Current (A)
P
B
P
2
±0.05
±0.20
±0.05
2
Punched Carrier Taping
0.01
P
t (s)
0
4.00
8.00
Kind of Taping
Taping running direction
P
W
0
±0.10
±0.20
10
✽ Reference Only
0.1
3.50
1.50
φD
F
±0.05
+0.10
–0
0
0.85
0.60
1.75
100
E
T
1
5.0 A
4.0 A
3.0 A
2.5 A
2.0 A
1.5 A
1.25 A
1.0 A
0.75 A
0.5 A
±0.10
±0.07
±0.07
● Taping Reel
● Type ERBSD
Pitch (P
● Type ERBSD
Dimensions
0.0001
0.0001
0.001
4 mm
2 mm
0.001
0.01
0.01
0.1
100
(mm)
10
0.1
10
1
0.0001
1
0.1
✽ Reference Only
1
)
180.0
φA
0.001
+0
−3.0
1
60 min.
Fusing Current (A)
φA
φB
φC
0.01
t (s)
10000 pcs./ reel
5000 pcs./ reel
13.0
Quantity
φC
10
±1.0
Micro Chip Fuse
W
✽ Reference Only
T
0.1
9.0
W
±1.0
Dec. 2007
100
11.4
1
3.0 A
2.5 A
2.0 A
1.5 A
1.25 A
1.0 A
0.75 A
0.5 A
0.375 A
0.315 A
0.25 A
T
±1.0