SKT24-3 SEMIKRON [Semikron International], SKT24-3 Datasheet
SKT24-3
Manufacturer Part Number
SKT24-3
Description
THYRISTOR
Manufacturer
SEMIKRON [Semikron International]
Datasheet
1.SKT24-3.pdf
(2 pages)
SKT 24,3 Qu ZG bond.
I
V
Size: 24,3 mm x 24,3 mm
Central gate
SKT 24,3 Qu ZG bond.
Features
• high current density due to double
• high surge current
• compatible to thick wire bonding
• compatible to all standard solder
Typical Applications*
• conrolled rectifier circuits
• solid state relays
© by SEMIKRON
T(DC)
THYRISTOR
RRM
mesa technology
processes
= 480 A
= 1600 V
SKT
Absolute Maximum Ratings
Symbol
V
V
I
I
i
T
Electrical Characteristics
Symbol
V
V
r
I
V
I
V
I
I
Dynamic Characteristics
Symbol
t
(di/dt)
(dv/dt)
Thermal Characteristics
Symbol
T
T
T
R
Mechanical Characteristics
Symbol
Raster
size
Area total
Anode
Gate and
Cathode
Wire bond
Package
Chips /
Package
2
T(AV)
TSM
T
GT
GD
H
L
q
t
jmax
j
stg
solder
RRM
DRM
T
T(TO)
GT
GD
th(j-c)
cr
cr
Rev. 0 – 19.02.2010
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
Conditions
Conditions
Conditions
Conditions
Semipack 3 assembly
Conditions
j
j
c
j
j
j
j
j
j
j
j
j
j
j
j
j
j
= 25 °C,
= 25 °C, I
= 130 °C, 10 ms, sin 180°
= 130 °C, 10 ms, sin 180°
= 130 °C, I
= 130 °C
= 130 °C
= 25 °C
= 25 °C
= 115 °C
= 130 °C
= 25 °C
= 25 °C
= 130 °C
= 130 °C
= 130 °C
= 80 °C, T
D
j
T
= 0.5 mA
= 130 °C
= 680 A
min.
min.
min.
0.25
-40
-40
11
Al,diameter ≤ 500µm
solderable (Ag/Ni)
bondable (Al)
24.3 x 24.3
Values
Values
336200
0.091
1600
1600
8200
typ.
typ.
typ.
400
130
150
590
tray
9
max.
max.
max.
1000
0.85
0.53
1.98
150
220
550
130
130
130
255
1.2
Unit
Unit
Unit
Unit
Unit
mm
A/µs
V/µs
mm
K/W
A
mΩ
mA
mA
mA
mA
pcs
°C
°C
°C
°C
µs
V
V
A
A
V
V
V
V
2
s
2
2
1
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SKT24-3 Summary of contents
Page 1
SKT 24 bond. THYRISTOR I = 480 A T(DC 1600 V RRM Size: 24 24,3 mm Central gate SKT 24 bond. Features • high current density due to double mesa technology • ...
Page 2
SKT 24 bond. This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX * The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested ...