emif02-spk01c2 STMicroelectronics, emif02-spk01c2 Datasheet
emif02-spk01c2
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emif02-spk01c2 Summary of contents
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... Mobile phones and communication systems ■ Computers and printers and MCU Boards Description The EMIF02-SPK01C2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The Flip-Chip packaging means the package size is equal to the die size. This filter includes ESD protection circuitry, which prevents damage to the application when it is subjected to ESD surges ...
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... Tolerance ±20% I line 2/7 Low-pass Filter GND GND Parameter = 25° C) amb Parameters RM Test conditions = per line EMIF02-SPK01C2 Output Ω Ri Cline = 200 pF GND Value 125 -40 to +85 -55 to +150 ...
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... EMIF02-SPK01C2 Figure 2. S21 (dB) attenuation measurement Figure 3. dB 0.00 - -5.00 - -10.00 - -15.00 -20.00 - -25.00 - -30.00 - -35.00 F (Hz) -40.00 100.0k 1.0M 1.0M 10.0M Figure 4. ESD response to IEC 61000-4-2 (+15 kV air discharge) on one input V and one output V in Figure 6. Line capacitance versus applied voltage C(pF) 250 200 150 100 100.0M 1.0G Figure 5. out F=1MHz ...
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... Rbump Lbump Figure 8. Aplac parameters Model D1 CJO=Cdiode1 BV=7 IBV=1u IKF=1000 IS=10f ISR=100p N=1 M=0.3333 RS=0.7 VJ=0.6 TT=50n 4/7 Rspk Lspk Lbump Rbump model = D2 model = D3 model = D2 Rspk Lspk Lbump Rbump EMIF02-SPK01C2 model Model D3 Model D2 CJO=Cdiode3 CJO=Cdiode2 BV=7 BV=7 IBV=1u IBV=1u IKF=1000 IKF=1000 IS=10f IS=10f ISR=100p ISR=100p N=1 N=1 M=0.3333 M=0.3333 RS=0.12 RS=0.3 VJ=0.6 VJ=0.6 TT=50n TT=50n ...
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... EMIF02-SPK01C2 2 Ordering information scheme EMI Filter Number of lines Information 3 letters = application 2 digits = version Package C = Coated Flip-Chip Leadfree Pitch = 500 µm, Bump = 315 µm 3 Package information Figure 9. Flip-Chip Dimensions Figure 10. Marking Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) EMIF 500 µ ...
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... Revision history Date 26-Jan-2006 6/7 Dot identifying Pin A1 location ST E xxz yww User direction of unreeling Marking Package Weight FX Flip-Chip 2.3 mg Revision 1 Initial release. EMIF02-SPK01C2 Ø 1.5 ± 0.1 4 ± 0 xxz xxz yww yww 4 ± 0.1 Base qty Delivery mode 5000 7” Tape and reel Changes ...
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... EMIF02-SPK01C2 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...