emif02-mic06f3 STMicroelectronics, emif02-mic06f3 Datasheet - Page 5

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emif02-mic06f3

Manufacturer Part Number
emif02-mic06f3
Description
2-line Ipad? Emi Filter And Esd Protection
Manufacturer
STMicroelectronics
Datasheet

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EMIF02-MIC06F3
2
3
Ordering information scheme
Figure 10. Ordering information scheme
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Figure 11. Flip Chip package dimensions
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
Package
F = Flip Chip
x = 3: Lead-free, Pitch = 400 µm
200 µm
1.20 mm ± 30 µm
400 µm ± 40
255 µm ± 40
EMIF
Ordering information scheme
yy
-
605 µm ± 55
xxx zz
Fx
®
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