MADP-000907-13050P MA-COM [M/A-COM Technology Solutions, Inc.], MADP-000907-13050P Datasheet

MADP-000907-13050P

Manufacturer Part Number

MADP-000907-13050P

Description

GaAs Flip Chip PIN Diode

Manufacturer

MA-COM [M/A-COM Technology Solutions, Inc.]

Datasheet

1.MADP-000907-13050P.pdf (5 pages)

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ADVANCED: Data Sheets contain information regarding a product M/A-COM is

considering for development. Performance is based on target specifications,

simulated results, and/or prototype measurements. Commitment to develop is not

guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has

under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may

be available. Commitment to produce in volume is not guaranteed.

GaAs

Flip Chip PIN Diode

Features

♦ Low Series Resistance

♦ Ultra Low Capacitance

♦ Millimeter Wave Switching & Cutoff Frequency

♦ 2 Nanosecond Switching Speed

♦ Can be Driven by a Buffered TTL

♦ Silicon Nitride Passivation

♦ Polyimide Scratch Protection

♦ RoHS Compliant

Description

M/A-COM's MA4GP907 is Gallium Arsenide (GaAs)

flip-chip PIN diode. It is fabricated using an OMCVD

epitaxial wafer with a process designed for high

device uniformity and extremely low parasitics. The

diode exhibits an extremely low RC product, (0.1ps)

and 2-3nS switching characteristics. They are fully

passivated with silicon nitride and have an added

polymer layer for scratch protection. The protective

coating prevents damage to the junction and the

anode air-bridge during handling and assembly.

Applications

The ultra low capacitance of the MA4GP907 allows

for operation up to millimeter frequencies for RF

switches and switched phase shifter applications.

The diode is designed for use in pulsed or CW

applications, where single digit nS switching speed

is required. The low capacitance of the MA4GP907

makes it for use in microwave multi-throw switch

assemblies, where the series capacitance of each

“off” port adversely loads the input and affects

VSWR.

MA4GP907

Absolute Maximum Ratings T

Operating Temperature

Mounting Temperature

C.W. Incident Power

Junction Temperature

Storage Temperature

Dissipated Power

Reverse Voltage

( RF & DC )

Parameter

(unless otherwise specified)

+280°C for 10 seconds

Absolute Maximum

-55°C to +125°C

-55°C to +150°C

+23 dBm

+175°C

50mW

50V

AMB

= +25°C

RoHS Compliant

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

Notes:

1. Gold Pads 14µM thick.

2. Yellow areas indicate ohmic gold mounting pads.

• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

DIM

Visit www.macomtech.com for additional data sheets and product information.

0.0135

0.0065

0.0043

0.0068

0.0182

0.026

MIN.

Chip Dimensions

Inches

0.0145

0.0075

0.0053

0.0073

0.0192

MAX.

0.027

M/A-COM Products

0.6604

0.3429

0.1651

0.1092

0.1727

0.4623

MIN.

Millimeters

0.6858

0.3683

0.1905

0.1346

0.1854

0.4877

MAX.

Rev. V6

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MADP-000907-13050P Summary of contents

Page 1

MA4GP907 GaAs Flip Chip PIN Diode Features ♦ Low Series Resistance ♦ Ultra Low Capacitance ♦ Millimeter Wave Switching & Cutoff Frequency ♦ 2 Nanosecond Switching Speed ♦ Can be Driven by a Buffered TTL ♦ Silicon Nitride Passivation ♦ ...

Page 2

MA4GP907 GaAs Flip Chip PIN Diode Electrical Specifications @ T Parameter Total Capacitance 1 Total Capacitance Series Resistance Series Resistance 2 Forward Voltage Reverse Voltage Current 3 4 Switching Speed Notes: 1) Capacitance is determined by measuring the isolation of ...

Page 3

MA4GP907 GaAs Flip Chip PIN Diode Typical RF Performance @ T I. Loss @5mA 0.0 -0.2 -0.4 -0.6 -0 Loss @5mA 0.0 -5.0 -10.0 -15.0 -20.0 -25.0 -30.0 -35.0 -40 ...

Page 4

MA4GP907 GaAs Flip Chip PIN Diode Typical RF Performance @ T 0.0 -5.0 -10.0 -15.0 -20.0 -25.0 -30.0 -35 ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for development. Performance is based ...

Page 5

... Maximum soldering temperature must be kept below 280°C for less than 10 seconds. Ordering Information Part Number Packaging MA4GP907 Waffle Pack MADP-000907-13050P Pocket Tape ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. ...

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