MADP-017025-1314 MA-COM [M/A-COM Technology Solutions, Inc.], MADP-017025-1314 Datasheet - Page 4

• Manufacturer Part Number: MADP-017025-1314
• Manufacturer: MA-COM [M/A-COM Technology Solutions, Inc.]

4
Handling
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin
oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components.
Bulk handling should insure that abrasion and mechanical shock are minimized.
Bonding
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are
conveniently located on the bottom surface of these devices and are removed from the active junction locations.
These devices are well suited for solder or conductive epoxy attachment onto hard and soft substrates. The use
of 60/40, Pb/Sn,
resistance and optimum heat sink.
When soldering these devices to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a
vacuum tip and applying a force of 40 - 60 grams to the top surface of the device. When soldering, position the die
so that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the
circuit trace near the mounting pads while applying 40 to 60 grams of force perpendicular to the top surface of the
die. Both mounting pads should be heated simultaneously so that the solder under both pads flows at the same
time. The solder joint should not be made one at a time. By doing so, would create an un-equal heat flow and
potentially create thermal stress to the chip.
Solder reflow should not be performed by causing heat to flow through the top surface of the die. Die should be
uniformly heated in a re-flow oven. Proper flow is easily determined looking down from the top since the HMIC
glass is transparent and the edges of the mounting pads can be visually inspected through the die after
attachment is complete. A typical soldering process profile and handling instructions are provided in
Application Notes,
MA-COM website at www.macomtech.com.
Conductive silver epoxy may also be used for die attachment, in lower Incident power applications where the
average power is < 1 W. Apply a thin controlled amount approximately 1- 2 mils thick to minimize ohmic and
thermal stresses. Take care not to bridge the gap between the chip pads with epoxy. A thin epoxy fillet should be
visible around the perimeter of the pads after placement to ensure full coverage. Cure per epoxy per
manufacturer’s recommended schedule.
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
SURMOUNT™ 25µM PIN Diodes
RoHS Compliant
MADP-017025-1314
MADP-030025-1314
M538 Surface Mounting Instructions
80/20, Au/Sn or any other lead-free solder is recommended to achieve the lowest series
MADP-017025-13140G
MADP-017025-13140P
MADP-030025-13140G
MADP-030025-13140P
Part Number
Assembly Guidelines
Ordering Information
and
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
100 piece gel pack
100 piece gel pack
• North America Tel: [phone] • Europe Tel: [phone]
• India Tel: [phone]
3000 piece reel
3000 piece reel
M541 Bonding and Handling Procedures
Visit www.macomtech.com for additional data sheets and product information.
Package
• China Tel: [phone]
Rev. V5
on the