tfdu6300 Vishay, tfdu6300 Datasheet

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tfdu6300

Manufacturer Part Number
tfdu6300
Description
Fast Infrared Transceiver Module Fir, 4 Mbit/s For 2.4 V To 3.6 V Operation
Manufacturer
Vishay
Datasheet

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TFDU6300
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TFDU6300
Vishay Semiconductors
Fast Infrared Transceiver Module (FIR, 4 Mbit/s)
for 2.4 V to 3.6 V Operation
Description
The TFDU6300 transceiver is an infrared transceiver
module compliant to the latest IrDA physical layer
low-power
communication, supporting IrDA speeds up to
4 Mbit/s (FIR), HP-SIR
based remote control modes up to 2 MHz. Integrated
within the transceiver module is a photo PIN diode, an
infrared emitter (IRED), and a low-power control IC to
provide a total front-end solution in a single package.
This new Vishay FIR transceiver is built in a new
smaller package using the experiences of the lead
frame BabyFace technology. The transceivers are
capable of directly interfacing with a wide variety of
I/O
demodulation function. At a minimum, a V
capacitor is the only external component required
Features
Applications
Parts Table
www.vishay.com
1
• Compliant to the latest IrDA physical layer
• Operates from 2.4 V to 3.6 V within
• Low power consumption (1.8 mA typ. supply
• Power shutdown mode (0.01 µA typ. shutdown
• Surface mount package
• Tri-state-receiver output, floating in shut down with
• Notebook computers, desktop PCs, palmtop
• Digital cameras and video cameras
• Printers, fax machines, photocopiers, screen
TFDU6300-TR3
TFDU6300-TT3
TFDU6300-TR1
TFDU6300-TT1
specification (up to 4 Mbit/s) with an
extended low power range of > 70 cm
(typ. 1 m) and TV remote control (> 9 m)
specification
current)
current)
a weak pull-up
computers (Win CE, Palm PC), PDAs
projectors
- Universal (L 8.5 mm x H 2.5 mm x W 3.1 mm)
devices,
Part
standard
which
®
perform
for
, Sharp ASK
Oriented in carrier tape for side view surface mounting
Oriented in carrier tape for side view surface mounting
Oriented in carrier tape for top view surface mounting
Oriented in carrier tape for top view surface mounting
fast
the
infrared
®
modulation/
and carrier
CC
bypass
Description
e3
data
implementing a complete solution. TFDU6300 has a
tri-state output and is floating in shutdown mode with
a weak pull-up. An otherwise identical transceiver
with low-voltage (1.8 V) logic levels is available as
TFDU6301.
• Low profile (universal) package capable of surface
• Directly interfaces with various super I/O and
• Only one external component required
• Split power supply, transmitter and receiver can be
• Lead (Pb)-free device
• Qualified for lead (Pb)-free and Sn/Pb processing
• Device in accordance with RoHS 2002/95/EC and
• Telecommunication products (cellular phones,
• Internet TV boxes, video conferencing systems
• External infrared adapters (dongles)
• Medical and industrial data collection
mount soldering to side and top view orientation
controller devices
operated from two power supplies with relaxed
requirements saving costs
(MSL4)
WEEE 2002/96EC
pagers)
20101
Qty/Reel or Tube
2500 pcs
2500 pcs
750 pcs
750 pcs
Document Number 84763
Rev. 1.7, 03-Jan-08

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tfdu6300 Summary of contents

Page 1

... Oriented in carrier tape for top view surface mounting www.vishay.com 1 infrared data ® and carrier 20101 implementing a complete solution. TFDU6300 has a tri-state output and is floating in shutdown mode with the modulation/ a weak pull-up. An otherwise identical transceiver bypass with low-voltage (1.8 V) logic levels is available as CC TFDU6301. • ...

Page 2

... Control GND Figure 1. Functional Block Diagram Description (V ). For higher voltages cc2 IRED - supply. cc1 . RXD echoes the TXD signal. cc1 Supply voltage Internally not connected. Ground Figure 2. Pinning TFDU6300 Vishay Semiconductors RXD V CC2 I/O Active I High cc1 O Low I High I www.vishay.com 2 ...

Page 3

... TFDU6300 Vishay Semiconductors Absolute Maximum Ratings Reference point Pin: GND unless otherwise noted. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. Parameter Supply voltage range, transceiver Supply voltage range, transmitter V Voltage at all I/O pins Input currents For all pins, except IRED anode pin ...

Page 4

... load 250 µ load Short to V CC1 R RXD t All modes SDPW ( V recommended to use the specified min./max. values to avoid increased CC1 TFDU6300 Vishay Semiconductors Min. Typ. Max. Unit 2.4 3.6 V 1.8 3.0 mA 2.0 3.3 mA 0.01 µA 1 µ °C - 0.5 0.5 ...

Page 5

... TFDU6300 Vishay Semiconductors Optoelectronic Characteristics Receiver ° 2 3.6 V unless otherwise noted. amb CC1 CC2 Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. Parameter Test Conditions 9.6 kbit/s to 115.2 kbit/s 1) Minimum irradiance E in λ = 850 nm to 900 nm, ...

Page 6

... TXD = High Low = 3.3 V, α = 0°, 15° CC1 I e α λ p Δλ ropt t fopt t opt 1.152 Mbit/s t opt 4 Mbit/s t opt 4 Mbit/s TFDU6300 Vishay Semiconductors Min. Typ. Max. Unit 330 440 600 mA t µs 18 150 µs 150 µ µ 180 ...

Page 7

... TFDU6300 Vishay Semiconductors Recommended Circuit Diagram Operated at a clean low impedance power supply the TFDU6300 needs no additional external components. However, depending on the entire system design and board layout, additional components may be required (see figure 3 IRED Anode CC2 CC1 C1 C2 ...

Page 8

... I/O manual, the Vishay application notes, or contact directly Vishay Sales, Marketing or Application. Mode Switching The TFDU6300 is in the SIR mode after power default mode, therefore the FIR data transfer rate has to be set by a programming sequence using the TXD and SD inputs as described below. The low frequency mode covers speeds up to 115 ...

Page 9

... With widespread use of forced convection reflow ovens the Ramp-To- Spike profile is used increasingly. Shown below in figure 6 and 7 are VISHAY's recommended profiles for use with the TFDU6300 transceivers. For more details please refer to the application note “SMD Assembly Instructions” (http://www.vishay.com/docs/82602/82602.pdf). ...

Page 10

... Package Dimensions in mm TFDU6300 (Universal) Package 20627 Footprint 7 x 0.95 = 6.65 0.95 0.2* 0 min 0.2 Photoimageable solder mask recommended between pads to prevent bridgeing Document Number 84763 Rev. 1.7, 03-Jan-08 Mounting Center 0.7 Top View Figure 8. Package Drawing TFDU6300 Vishay Semiconductors Mounting Center Side View 20626 www.vishay.com 10 ...

Page 11

... TFDU6300 Vishay Semiconductors Reel Dimensions in mm Drawing-No.: 9.800-5090.01-4 Issue: 1; 29.11.05 14017 Tape Width A max 180 16 330 www.vishay.com 11 Figure 9. Reel drawing W min. W max 16.4 22.4 50 16.4 22.4 W min. W max 15.9 19.4 15.9 19.4 Document Number 84763 Rev. 1.7, 03-Jan-08 ...

Page 12

... Tape Dimensions in mm Drawing-No.: 9.700-5280.01-4 Issue: 1; 03.11.03 19855 Figure 10. Tape drawing, TFDU6300 for top view mounting Document Number 84763 Rev. 1.7, 03-Jan-08 TFDU6300 Vishay Semiconductors www.vishay.com 12 ...

Page 13

... TFDU6300 Vishay Semiconductors Tape Dimensions in mm Drawing-No.: 9.700-5279.01-4 Issue: 1; 08.12.04 19856 Figure 11. Tape drawing, TFDU6300 for side view mounting www.vishay.com 13 19856 Document Number 84763 Rev. 1.7, 03-Jan-08 ...

Page 14

... Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Document Number 84763 Rev. 1.7, 03-Jan-08 and may do so without further notice. TFDU6300 Vishay Semiconductors www.vishay.com 14 ...

Page 15

... Information contained herein is intended to provide a product description only. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right ...

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