JANHCA2N2484 STMICROELECTRONICS [STMicroelectronics], JANHCA2N2484 Datasheet - Page 11

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JANHCA2N2484

Manufacturer Part Number
JANHCA2N2484
Description
SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON, LOW-POWER TYPES 2N2484, 2N2484UA, 2N2484UB, JAN, JANTX, JANTXV, JANS, JANHC, AND JANKC
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
requirements:
subgroup testing in table VII of MIL-PRF-19500, and in 4.4.3.1 (JANS).and 4.4.3.2 (JAN, JANTX, and JANTXV)
herein for group C testing. Electrical measurements (end-points) shall be in accordance with group A, subgroup 2
herein. Delta requirements shall be in accordance with table III herein.
inspection lot containing the intended package type and lead finish procured to the same specification which is
submitted to and passes group A tests for conformance inspection. Testing of a subgroup using a single device
type enclosed in the intended package type shall be considered as complying with the requirements for that
subgroup.
tests specified in table II herein must be performed to maintain qualification.
750.
4.4.2.3 Group B sample selection. Samples selected from group B inspection shall meet all of the following
4.4.3 Group C inspection, Group C inspection shall be conducted in accordance with the conditions specified for
4.4.3.1 Group C inspection, table VII (JANS) of MIL-PRF-19500.
4.4.3.2 Group C inspection, table VII (JAN, JANTX, and JANTXV) of MIL-PRF-19500.
4.4.3.3 Group C sample selection. Samples for subgroups in group C shall be chosen at random from any
4.4.4 Group E inspection. Group E inspection shall be performed for qualification or re-qualification only. The
4.5 Method of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows.
4.5.1 Pulse measurements. Conditions for pulse measurement shall be as specified in section 4 of MIL-STD-
a.
b.
Subgroup
Subgroup
C2
C6
C2
C6
For JAN, JANTX, and JANTXV, samples shall be selected randomly from a minimum of three wafers (or
from each wafer in the lot) from each wafer lot. For JANS, samples shall be selected from each inspection
lot. See MIL-PRF-19500.
Must be chosen from an inspection lot that has been submitted to and passed group A, subgroup 2
conformance inspection. When the final lead finish is solder or any plating prone to oxidation at high
temperature, the samples for life test (subgroups B4 and B5 for JANS, and group B for JAN, JANTX, and
JANTXV) may be pulled prior to the application of final lead finish.
2036
1026
Method
Method
2036
Test condition E (not applicable to UA and UB suffix devices).
1,000 hours at V
and a minimum power dissipation P
herein.
Not applicable.
Condition
Condition
Test condition E (not applicable to UA and UB suffix devices).
CB
= 10 -30 V dc; power shall be applied to achieve T
MIL-PRF-19500/376E
11
D
= 75 percent of maximum rated P
J
T
= 150 C minimum
as defined in 1.3

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