is27hc010 Integrated Silicon Solution, Inc., is27hc010 Datasheet - Page 4

• Manufacturer Part Number: is27hc010
• Description: 131,072 X 8 High-speed Cmos Eprom
• Manufacturer: Integrated Silicon Solution, Inc.

IS27HC010
Output OR-Tieing
To accommodate multiple memory connections, a two-
line control function is provided to allow for:
It is recommended that
primary device-selecting function, while
common connection to all devices in the array and con-
nected to the READ line from the system control bus. This
assures that all deselected memory devices are in their
low-power standby mode and that the output pins are only
active when data is desired from a particular memory
device.
LOGIC SYMBOL
4
TRUTH TABLE
Notes:
1. V
2. X = Either V
3. A1-A8 = A10-A16 = V
4. See DC Programming Characteristics for V
5. The IS27HC010 can use the same write algorithm during program as other IS27C010 or IS27010 devices.
Mode
Read
Output Disable
Standby
Program
Program Verify
Program Inhibit
Auto Select
H
1. Low memory power dissipation, and
2. Assurance that output bus contention will not
= 12.0V
occur.
17
(3,5)
IH
0.5V.
or V
Manufacturer Code
(1,2)
A0-A16
CE (E)
PGM (P)
OE (G)
IL
.
IL
.
CE
Device Code
DQ0-DQ7
be decoded and used as the
OE
8
PP
CE CE CE CE CE
V
V
V
V
V
V
V
V
IH
IH
IL
IL
IL
IL
IL
IL
voltage during programming.
be made a
OE OE OE OE OE
V
V
V
V
V
V
X
X
IH
IH
IL
IL
IL
IL
System Applications
During the switch between active and standby conditions,
transient current peaks are produced on the rising and
falling edges of Chip Enable. The magnitude of these
transient current peaks is dependent on the output capaci-
tance loading of the device at a minimum, a 0.1 F ceramic
capacitor (high-frequency, low inherent inductance) should
be used on each device between V
mize transient effects. In addition, to overcome the voltage
drop caused by the inductive effects of the printed circuit
board traces on EPROM arrays, a 4.7 F bulk electrolytic
capacitor should be used between V
eight devices. The location of the capacitor should be
close to where the power supply is connected to the array.
PGM
PGM
PGM
PGM
PGM
V
V
X
X
X
X
X
X
IH
IL
V
A0
V
X
X
X
X
X
X
IH
IL
Integrated Silicon Solution, Inc.
A9
V
V
X
X
X
X
X
X
H
H
V
V
V
V
V
V
V
V
V
CC
CC
CC
CC
CC
CC
CC
PP
PP
PP
PP
and GND for each
and GND to mini-
Outputs
D
D
D5H
0EH
Hi-Z
Hi-Z
Hi-Z
D
OUT
OUT
IN
ISSI
EP009-1F
07/18/97
®