RF3300-3 RFMD [RF Micro Devices], RF3300-3 Datasheet - Page 4

• Manufacturer Part Number: RF3300-3
• Description: 3V 1900MHz LINEAR AMPLIFIER MODULE
• Manufacturer: RFMD [RF Micro Devices]

2-550
Note: Where Type code is:
Pin
10
11
12
13
RF3300-3
1
2
3
4
5
6
7
8
9
GND_SLUG
PDET_OUT
Function
RF OUT
VMODE
PA_ON
VCC3
VCC1
VCC2
RF IN
GND
GND
GND
GND
Description
Bias circuit and HDET power supply. A low frequency decoupling
capacitor (2.2µF) is required. Type: P
Ground connection. Connect to the GND_SLUG pin. For best perfor-
mance, keep traces physically short and connect immediately to
ground plane. Type: P
Ground connection. Connect to the GND_SLUG pin. For best perfor-
mance, keep traces physically short and connect immediately to
ground plane. Type: P
RF input internally matched to 50Ω. This input is internally AC-coupled
at the IC; however a shunt inductor used in the input matching network
will provide a DC path to ground for components connected to the RF
IN pin. A DC blocking capacitor may be required at this pin. Type: A, I
First stage power supply. A low frequency decoupling capacitor (2.2µF)
is required. Type: P
Ground connection. Connect to the GND_SLUG pin. For best perfor-
mance, keep traces physically short and connect immediately to
ground plane. Type: P
Ground connection. Connect to the GND_SLUG pin. For best perfor-
mance, keep traces physically short and connect immediately to
ground plane. Type: P
RF output internally matched to 50Ω. This input is internally AC-cou-
pled. Type: A, O
Output stage power supply. A low frequency decoupling capacitor
(2.2µF) is required. Type: P
Power detector output. Type: A, O
Gain step control. When this pin is High, the module is in low power
mode, and the amplifier’s current is reduced. When this pin is Low, the
module is in high power mode. Voltage should not be applied to this pin
before VCC3 is applied. Type: D, I
Device enable control. When this pin is High, the device is on. When
this pin is Low, the device is off. Voltage should not be applied to this
pin before VCC3 is applied. Type: D, I
Ground connection. The backside of the package should be soldered to
a top side ground pad which is connected to the ground plane with mul-
tiple vias. The pad should have a short thermal path to the ground
plane. Type: P
I=Input; O=Output; A=Analog; D=Digital; P=Power
Interface Schematic
RF IN
Rev A5 030612
Stage
From
Bias
VCC1