pe-68032 Pulse Specialty Components, pe-68032 Datasheet - Page 4

• Manufacturer Part Number: pe-68032
• Description: Low Profile Surface Mount 10base-t Interface Modules
• Manufacturer: Pulse Specialty Components

LOW PROFILE SURFACE MOUNT
10BASE-T INTERFACE MODULES
Ideal for Type I or Type II PCMCIA Applications
Application
Pulse’s ThinSet
functions, mechanical packaging and process standards.
Electrical Functions
• Impedance Matching • Equipment Isolation • EMI suppression
Each module contains low pass filters, isolation transformers, and
common mode chokes. Most also include pre-emphasis and
impedance matching resistors. Please refer to the appropriate
application circuit and resistor chart for specific configurations.
Mechanical Packaging
• Dimensions • External Features • Internal Construction
The low .094" profile allows for use in both Type I and Type II
applications. ThinSet
compact form factor for improved thermal management. Compliant
leads provide excellent solder-joint reliability with ±.002" coplanarity.
Advanced mechanical design yields more consistent and repeatable
electrical performance.
Performance warranty of products offered on this data sheet is limited to the parameters specified. Data is subject to change without notice. Other brand and product names
mentioned herein may be trademarks or registered trademarks of their respective owners.
© Copyright, 2007. Pulse Engineering, Inc. All rights reserved.
ww.pulseeng.com
For More Information:
Pulse Worldwide
Headquarters
12220 World Trade Dr.
San Diego, CA 92128
U.S.A.
www.pulseeng.com
TEL: [phone]
FAX: [phone]
TM
10Base-T modules are the optimum analog solution for PCMCIA applications. Primary design features include electrical
TM
Pulse European
Headquarters
Einsteinstrasse 1
71083 Herrenberg
Germany
TEL: [phone]
FAX: [phone]
modules are highly integrated to keep a
Pulse China
Headquarters
B402, Shenzhen
Tech-Innovation International
10th Kejinan Rd.
High-Tech Industrial Park
Nanshan District, Shenzen
China
TEL: [phone]
FAX: [phone]
4
Process Standards
• SMT requirements • Quality Assurance • Construction Methods
Materials, resistant to high temperatures, have been selected for
thermal compatibility to comply with industry standard reflow
methods. Post dipping the leads helps ensure solderability to the PC
board. Improved construction techniques increase package reliability
in high stress environments.
Note:
Modules are packaged in tubes unless tape and reel is specified.
Please add the suffix “T” (i.e. PE-68032T) for tape and reel orders,
increments of 600 pieces.
Pulse North China
Room 1503
XinYin Building
No. 888 YiShan Road
Shanghai 200233
China
TEL: [phone]
FAX: [phone]
Pulse South Asia
150 Kampong Ampat
#07-01/02
KA Centre
Singapore 368324
TEL: [phone]
FAX: [phone]
Pulse North Asia
No. 26
Kao Ching Road
Yang Mei Chen
Taoyuan Hsien
Taiwan, R. O. C.
TEL: [phone]
FAX: [phone]
E103.B (9/07)