B32686S EPCOS [EPCOS], B32686S Datasheet - Page 16

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B32686S

Manufacturer Part Number
B32686S
Description
Metallized Polypropylene Film Capacitors (MFP)
Manufacturer
EPCOS [EPCOS]
Datasheet
3
In many applications, finished circuit assemblies are embedded in plastic resins. In this case,
both chemical and thermal influences of the embedding ("potting") and curing processes must be
taken into account.
Our experience has shown that the following potting materials can be recommended: non-flexible
epoxy resins with acid-anhydride hardeners; chemically inert, non-conducting fillers; maximum
curing temperature of 100 C.
Caution:
Consult us first if you wish to embed uncoated types!
Please read Cautions and warnings and
Important notes at the end of this document.
Embedding of capacitors in finished assemblies
B32686S
Snubber
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