pe42612 Peregrine Semiconductor Corp., pe42612 Datasheet - Page 3

• Manufacturer Part Number: pe42612
• Description: Sp4t Ultracmos 2.6 V Switch 100 ? 3000 Mh
• Manufacturer: Peregrine Semiconductor Corp.

PE42612
Product Brief
Figure 3. Pin Configuration (Ball-Side Up)
Table 4. Pin Descriptions
Note:
Table 6. Ordering Information
PE42612-90 (Unitive)
PE42612-91 (FCI)
PE42612-00
Document No. 70-0217-01 │ www.psemi.com
Contact [e-mail] for full version of datasheet
Pin No.
10
12
11
1
3
8
2
4
5
6
7
9
5
5
5
5
5
TX1
GND
TX2
GND
5. Blocking capacitors needed only when non-zero DC
voltage present.
Pin Name
Order Code
10
GND
GND
GND
VDD
9
8
7
RX1
RX2
ANT
TX2
TX1
N/C
V1
V2
N/C
VDD
11
PE42612
6
Die
RF I/O - TX2
RF I/O - TX1
No Connect – Pin to be connected to an
electrically isolated low capacitance pad
RF I/O – RX1
Ground
RF I/O – RX2
Switch control input, CMOS logic level
Switch control input, CMOS logic level
Supply
Ground
Ground
RF Common – Antenna Input
ANT
12
V2
5
1
2
3
4
C9817_1
C9817_1
C9817_1
Description
RX1
GND
RX2
Die ID
V1
PE42612-DIE-D
PE42612-DIE-D
PE42612-DIE-1H
Description
Table 5. Truth Table
Electrostatic Discharge (ESD) Precautions
When handling this UltraCMOS™ device, observe
the same precautions that you would use with other
ESD-sensitive devices. Although this device
contains circuitry to protect it from damage due to
ESD, precautions should be taken to avoid
exceeding the specified rating.
Latch-Up Avoidance
Unlike conventional CMOS devices, UltraCMOS™
devices are immune to latch-up.
Film Frame
Film Frame
Evaluation Kit
©2006 Peregrine Semiconductor Corp. All rights reserved.
Package
ANT - RX1
ANT - RX2
ANT - TX1
ANT - TX2
Path
Wafer (Gross Die / Wafer Quantity)
Wafer (Gross Die / Wafer Quantity)
1 / Box
Shipping Method
V2
0
0
1
1
Page 3 of 4
V1
0
1
0
1