apm4538k Anpec Electronics Corporation, apm4538k Datasheet - Page 12

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apm4538k

Manufacturer Part Number
apm4538k
Description
Dual Enhancement Mode Mosfet N-and P-channel
Manufacturer
Anpec Electronics Corporation
Datasheet
Classificatin Reflow Profiles(Cont.)
Carrier Tape & Reel Dimensions
Reliability Test Program
Table 1. SnPb Entectic Process – Package Peak Reflow Tem peratures
SOLDERABILITY
HOLT
PCT
TST
Table 2. Pb-free Process – Package Classification Reflow Tem peratures
*Tolerance: The device m anufacturer/supplier shall assure process com patibility up to and
including the stated classification tem perature (this m eans Peak reflow tem perature +0 C.
For exam ple 260 C+0 C) at the rated MSL level.
Package Thickness
1.6 m m – 2.5 m m
Package Thickness
<1.6 m m
2.5 m m
Test item
<2.5 m m
2.5 m m
W
E
F
Volum e mm
MIL-STD-883D-2003
MIL-STD 883D-1005.7
JESD-22-B, A102
MIL-STD 883D-1011.9
260 +0 C*
260 +0 C*
250 +0 C*
<350
P o
A o
Volum e m m
240 +0/-5 C
225 +0/-5 C
3
Method
P 1
P
<350
Volum e mm
3
D
D 1
260 +0 C*
250 +0 C*
245 +0 C*
350-2000
245°C,5 SEC
1000 Hrs Bias @ 125°C
168 Hrs, 100% RH, 121°C
-65°C ~ 150°C, 200 Cycles
3
B o
K o
Volum e m m
Description
225 +0/-5 C
225 +0/-5 C
Volum e mm
260 +0 C*
245 +0 C*
245 +0 C*
t
www.anpec.com.tw
350
>2000
3
3

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