bl-hb533-tre- BRIGHT LED ELECTRONICS CORP, bl-hb533-tre- Datasheet - Page 7
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bl-hb533-tre-
Manufacturer Part Number
bl-hb533-tre-
Description
Smd Led Bl-hb533-tre[
Manufacturer
BRIGHT LED ELECTRONICS CORP
Datasheet
1.BL-HB533-TRE-.pdf
(8 pages)
●
● Handling :
1. Manual Of Soldering
2. Reflow Soldering
3. DIP soldering (Wave Soldering) :
Soldering :
Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to
high temperature.
Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such
as the sand blast and the metal hook.
SINCE 1981
Preheating : 140℃~160℃±5℃,within 2 minutes.
Operation heating : 260℃(Max.) within 10 seconds.(Max)
Gradual Cooling (Avoid quenching).
Preheating : 120℃~150℃,within 120~180 sec.
Operation heating : 245℃±5℃ within 5 sec.260℃ (Max)
Gradual Cooling (Avoid quenching).
The temperature of the iron tip should not be higher than 300℃(572℉) and Soldering within 3
seconds per solder-land is to be observed.
B
B
R
R
120~150℃
140~160℃
I
I
G
G
Soldering heat Max. 260 ℃
OVER 2 MIN.
H
120~180 sec.
H
4℃ /SEC. MAX.
Time
Time
Preheat
T
T
260℃ MAX.
L
L
E
E
D
D
10 SEC. MAX.
E
E
L
L
245 ±5℃ within 5 sec.
E
E
4℃ /SEC. MAX.
C
C
T
T
R
R
O
O
N
N
I
I
C
C
B
B
S
S
L
L
Ver.1.1 Page 6 of 7
-
-
H
H
C
C
B
B
5
5
O
O
3
3
3
3
R
-
R
-
T
T
R
R
P
P
E
E
.
.