hbcr-2210 Avago Technologies, hbcr-2210 Datasheet - Page 11

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hbcr-2210

Manufacturer Part Number
hbcr-2210
Description
Programmable Bar Code Decode Ics - Agilent Hewlett-packard
Manufacturer
Avago Technologies
Datasheet
PLCC Drying
Whenever Vapor Phase or Infra-
red Reflow Technologies are used
to mount the PLCC packages,
there is a possibility that
previously absorbed moisture,
heated very rapidly to the reflow
temperatures, may cause the
package to crack from the
internal stresses. There is a
reliability concern that moisture
may then enter the package over
a period of time, and metal
corrosion may take place,
degrading the IC performance.
To reduce the amount of
absorbed moisture and prevent
cracking, all of the PLCC ICs
should undergo one of the
Pin Definitions
Figure 3. HBCR-2210 Serial Pinout.
XTAL 2
XTAL 1
TRG
BPR
BR0
BR1
STB
CTS
RTS
LSE
SCT
RST
RxD
SSY
LED
TxD
V
SDI
WR
RD
SS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
V
AD0
AD1
AD2
AD3
AD4
AD5
AD6
AD7
EA + 5 V
ALE
NC
SMD + 5 V
EEP
EPC
ECE/PT1
EIO/PT0
A10
A9
A8
CC
following baking cycles. The
parts must then be mounted
within 48 hours.
If the parts are not mounted with-
in 48 hours, they must be re-
baked.
The total number of baking cycles
must not exceed two. If the ICs
are baked more than twice,
Note:
8. Cycle B must be done in atmosphere of <5% relative
Cycle
humidity air or nitrogen.
B
A
AD0-AD7
BR0-BR1
PT0-PT1
XTAL1
XTAL2
V SS
SMD
BPR
EPC
ECE
TRG
V CC
RxD
STB
LSE
SCT
LED
RTS
CTS
RST
EEP
SSY
ALE
TxD
A10
Temperature
SDI
WR
EIO
RD
EA
A8
A9
125 C
60 C
ADDRESS/DATA BUS
RECEIVED DATA
TRANSMITTED DATA
BAUD RATE
PARITY
STOP BITS
LASER SCAN ENABLE
SCANNER TYPE
SCANNER DIGITAL INPUT
LED CONTROL LINE
BEEPER CONTROL LINE
DATA MEMORY WRITE
DATA MEMORY READ
CRYSTAL INPUT
CRYSTAL INPUT
SERIAL MODE SELECT
REQUEST TO SEND
CLEAR TO SEND
IC RESET
EEPROM SELECT
EEPROM CLOCK
EEPROM CHIP ENABLE
EEPROM I/O
LASER TRIGGER LINE
SCANNER SYNCHRONIZATION
ADDRESS LINE #8
ADDRESS LINE #9
ADDRESS LINE #10
EXTERNAL PROGRAM ENABLE
ADDRESS LATCH ENABLE
POWER
GROUND
PIN MNEMONICS
24 hrs
96 hrs
Time
Hewlett-Packard cannot guaran-
tee the performance and
reliability of the parts.
Neither bake cycle can be per-
formed in the standard shipping
tubes. The ICs must be baked in
an ESD safe, mechanically stable
container, such as an aluminum
tube or pan.
Notes
8
4-57

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