TN25 STMICROELECTRONICS [STMicroelectronics], TN25 Datasheet - Page 4

• Manufacturer Part Number: TN25
• Description: 25A SCRs
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

TN25 and TYNx25 Series
4/7
Fig. 1: Maximum average power dissipation
versus average on-state current.
Fig. 2-2: Average and D.C. on-state current
versus ambient temperature (copper surface
under tab: S = 1 cm² (for D²PAK).
Fig. 4: Relative variation of gate trigger current,
holding current and latching current versus
junction temperature.
2.5
2.0
1.5
1.0
0.5
0.0
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
24
22
20
18
16
14
12
10
8
6
4
2
0
-40
0
0
P(W)
IGT,IH,IL [Tj] / IGT ,IH,IL [Tj = 25 °C]
IT(av)(A)
= 180°
-20
= 180°
IH & IL
2
IGT
25
4
0
D.C.
20
6
50
IT(av)(A)
40
Tamb(°C)
8
Tj(°C)
10
60
75
80
12
100
14
100
360°
120
16
125
140
Fig. 2-1: Average and D.C. on-state current
versus case temperature.
Fig. 3: Relative variation of thermal impedance
versus pulse duration.
Fig. 5: Surge peak on-state current versus
number of cycles.
1.00
0.10
0.01
350
300
250
200
150
100
28
26
24
22
20
18
16
14
12
10
50
8
6
4
2
0
0
1E-3
0
IT(av)(A)
1
ITSM(A)
K = [Zth/Rth]
Zth(j-c)
1E-2
25
Tcase = 100 °C
Repetitive
Tj initial = 25 °C
1E-1
Non repetitiv e
10
Number of cycles
D.C.
50
= 180°
Tcase(°C)
Zth(j-a)
tp(s)
1E+0
75
100
1E+1
100
tp = 10ms
One cycle
1E+2 5E+2
1000
125