NTB30N20T4 ONSEMI [ON Semiconductor], NTB30N20T4 Datasheet

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NTB30N20T4

Manufacturer Part Number
NTB30N20T4
Description
Power MOSFET 30 Amps, 200 Volts N−Channel Enhancement−Mode D2PAK
Manufacturer
ONSEMI [ON Semiconductor]
Datasheet

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Manufacturer:
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Quantity:
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Part Number:
NTB30N20T4G
Manufacturer:
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Quantity:
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NTB30N20
Power MOSFET
30 Amps, 200 Volts
N−Channel Enhancement−Mode D
Features
Typical Applications
1. When surface mounted to an FR4 board using the minimum recommended
2. Pulse Test: Pulse Width = 10 s, Duty Cycle = 2%.
MAXIMUM RATINGS
April, 2004 − Rev. 3
Drain−to−Source Voltage
Drain−to−Source Voltage (R
Gate−to−Source Voltage
Drain Current
Total Power Dissipation @ T
Total Power Dissipation @ T
Operating and Storage Temperature Range
Single Drain−to−Source Avalanche Energy −
Thermal Resistance
Maximum Lead Temperature for Soldering
Fast Recovery Diode
Source−to−Drain Diode Recovery Time Comparable to a Discrete
Avalanche Energy Specified
I
Mounting Information Provided for the D
PWM Motor Controls
Power Supplies
Converters
Semiconductor Components Industries, LLC, 2004
pad size, (Cu Area 0.412 in
DSS
Derate above 25 C
Starting T
(V
I
Purposes for 10 seconds
L
(pk) = 20 A, L = 3.0 mH, R
DD
− Continuous
− Non−Repetitive (t
− Continuous @ T
− Continuous @ T
− Pulsed (Note 2)
− Junction−to−Case
− Junction−to−Ambient
− Junction−to−Ambient (Note 1)
and R
= 100 Vdc, V
J
DS(on)
= 25 C
Rating
Specified at Elevated Temperature
GS
(T
A
A
= 10 Vdc,
p
C
25 C
100 C
v10 ms)
= 25 C unless otherwise noted)
GS
A
A
2
).
= 25 C
= 25 C (Note 1)
G
= 1.0 M )
= 25 )
2
PAK Package
Symbol
T
V
V
V
R
R
R
J
V
E
I
GSM
P
P
DSS
DGR
DM
, T
T
I
I
GS
AS
D
D
D
D
JC
L
JA
JA
stg
−55 to
Value
+175
"30
"40
1.43
62.5
2
200
200
214
450
260
2.0
0.7
30
22
90
50
PAK
1
W/ C
Unit
Vdc
Vdc
Vdc
Adc
C/W
mJ
W
W
C
C
NTB30N20
NTB30N20T4
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
1
200 V
Device
V
CASE 418B
DSS
2
STYLE 2
D
3
ORDERING INFORMATION
2
PAK
NTB30N20 = Device Code
LL
Y
WW
G
http://onsemi.com
68 m @ V
Package
N−Channel
R
4
D
D
DS(ON)
2
2
PAK
PAK
D
= Location Code
= Year
= Work Week
Publication Order Number:
MARKING DIAGRAM
MARKING DIAGRAM
& PIN ASSIGNMENT
& PIN ASSIGNMENT
GS
S
Gate
TYP
= 10 V
1
NTB30N20
LLYWW
800 Tape & Reel
Drain
Drain
50 Units/Rail
Shipping
4
2
NTB30N20/D
I
D
30 A
3
Source
MAX

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NTB30N20T4 Summary of contents

Page 1

... C 260 C L Device NTB30N20 NTB30N20T4 †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 1 http://onsemi.com R TYP I MAX DSS DS(ON N− ...

Page 2

ELECTRICAL CHARACTERISTICS Characteristic OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage ( Vdc 250 Adc Temperature Coefficient (Positive) Zero Gate Voltage Collector Current ( Vdc 200 Vdc ...

Page 3

DRAIN−TO−SOURCE VOLTAGE (VOLTS) DS Figure 1. On−Region Characteristics 0 ...

Page 4

Switching behavior is most easily modeled and predicted by recognizing that the power MOSFET is charge controlled. The lengths of various switching intervals ( t) are determined by how fast the FET input capacitance can be charged by current from ...

Page 5

TOTAL GATE CHARGE (nC) G Figure 8. Gate−To−Source and Drain−To−Source Voltage versus Total Charge DRAIN−TO−SOURCE DIODE CHARACTERISTICS 30 ...

Page 6

SINGLE PULSE 100 LIMIT DS(on) THERMAL LIMIT PACKAGE LIMIT 0.1 0.1 1 DRAIN−TO−SOURCE VOLTAGE (VOLTS) DS Figure 11. Maximum Rated Forward Biased Safe ...

Page 7

−T− SEATING PLANE 0.13 (0.005) VARIABLE CONFIGURATION ZONE VIEW W−W VIEW W−W 1 0.42 10.66 *For additional information on our Pb−Free strategy and soldering details, ...

Page 8

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for ...

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