q67050-a4210-a101 Infineon Technologies Corporation, q67050-a4210-a101 Datasheet

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q67050-a4210-a101

Manufacturer Part Number
q67050-a4210-a101
Description
Igbt Chip
Manufacturer
Infineon Technologies Corporation
Datasheet
IGBT
FEATURES:
Chip Type
MECHANICAL PARAMETER:
Raster size
Emitter pad size ( include gate pad )
Gate pad size
Area total / active
Thickness
Wafer size
Flat position
Max.possible chips per wafer
Passivation frontside
Emitter metallization
Collector metallization
Die bond
Wire bond
Reject Ink Dot Size
Recommended Storage Environment
Edited by INFINEON Technologies AI PS DD HV3, L7681B, Edition 2, 04.09.03
SIGC109T120R3L
1200V Trench + Field Stop technology
120µm chip
low turn-off losses
short tail current
positive temperature coefficient
easy paralleling
3
Chip
V
1200V 100A
CE
I
Cn
Die Size
10.47 x 10.44 mm
This chip is used for:
Applications:
power module
drives
suitable for epoxy and soft solder die bonding
< 6 month at an ambient temperature of 23°C
store in original container, in dry nitrogen,
electrically conductive glue or solder
SIGC109T120R3L
10.47 x 10.44
1400 nm Ni Ag –system
2
109.3 / 85.8
8.95 x 8.32
1.14 x 1.14
0.65mm ; max 1.2mm
Package
3200 nm AlSiCu
120
150
sawn on foil
90
Al, <500µm
Photoimide
124 pcs
Ordering Code
A4210-A101
G
Q67050-
mm
mm
mm
µm
grd
C
E
2

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q67050-a4210-a101 Summary of contents

Page 1

... Ni Ag –system suitable for epoxy and soft solder die bonding electrically conductive glue or solder store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23° Package Ordering Code Q67050- sawn on foil A4210-A101 mm mm 120 µm 150 mm 90 grd ...

Page 2

MAXIMUM RATINGS: Parameter Collector-emitter voltage = collector current, limited by T Pulsed collector current, t limited Gate emitter voltage Operating junction and storage temperature 1 ) depending on thermal properties of assembly STATIC ...

Page 3

CHIP DRAWING: Edited by INFINEON Technologies HV3, L7681B, Edition 2, 04.09.03 SIGC109T120R3L ...

Page 4

FURTHER ELECTRICAL CHARACTERISTICS: This chip data sheet refers to the device data sheet DESCRIPTION: AQL 0,65 for visual inspection according to failure catalog Electrostatic Discharge Sensitive Device according to MIL-STD 883 Test-Normen Villach/Prüffeld Published by Infineon Technologies AG, Bereich Kommunikation ...

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