cxg1173ur Sony Electronics, cxg1173ur Datasheet
cxg1173ur
Available stocks
Related parts for cxg1173ur
cxg1173ur Summary of contents
Page 1
... High Power SPDT Switch with Logic Control Description The CXG1173UR can be used in wireless com- munication systems, for example, CDMA handsets, W-CDMA handsets, 2.4GHz WLAN. The CXG1173UR has on-chip logic for operation with 1 CMOS control inputs. The Sony J-FET process is used for low insertion loss and on-chip logic circuit ...
Page 2
... Truth Table CTL ON State RF1 – RF2 ON OFF L RF1 – RF3 OFF GND RF2 8 F3 GND Cbypass (100pF OFF ON ON OFF – 2 – 4 GND 3 RF3 GND 1 12 Cbypass (100pF) Rctl ( recommended. CXG1173UR ...
Page 3
... Max. Unit 0.30 0.50 dB 0.45 0. 1.2 1.5 — µs 34 dBm 55 63 dBm –60 –50 dBc –65 –55 dBc –60 –50 dBc –65 –55 dBc –75 –55 dBc –75 –60 dBc –75 –55 dBc –75 –60 dBc 65 100 µ µA = 3.0V CXG1173UR ...
Page 4
... Symbol 2 RF3 RF input/output. Connect capacitor (recommended value: 100pF) in use 5 RF1 RF input/output. Connect capacitor (recommended value: 100pF) in use 8 RF2 RF input/output. Connect capacitor (recommended value: 100pF) in use power supply DD 12 CTL Logic control GND GND Description – 4 – CXG1173UR ...
Page 5
... PLASTIC 0.55 ± 0. 0.18 S Solder Plating + 0.09 0.14 – 0.03 TERMINAL SECTION PACKAGE STRUCTURE PACKAGE MATERIAL LEAD TREATMENT UQFN-12P-01 LEAD MATERIAL PACKAGE MASS SPEC. COPPER ALLOY Sn-Bi Bi:1-4wt% 5-18 m – 5 – CXG1173UR 0.1 S A-B 0.4 ± 0.1 0 0.4 0.07 0.25 S A 0.09 0.25 – 0.03 EPOXY RESIN SOLDER PLATING COPPER ALLOY ...