cxg1104tn Sony Electronics, cxg1104tn Datasheet

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cxg1104tn

Manufacturer Part Number
cxg1104tn
Description
High Power Spdt Switch With Logic Control
Manufacturer
Sony Electronics
Datasheet

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CXG1104TN
Manufacturer:
SONY/索尼
Quantity:
20 000
Description
MMIC for use in cellular handsets, for example, CDMA.
the switch circuit to operate by 1 CMOS control line.
loss and on-chip logic circuit.
Features
• Low insertion loss: 0.3dB @900MHz, 0.4dB @1.9GHz
• High linearity: IIP3 (Typ.) = 70dBm
• 1 CMOS compatible control line
• Small package size: 10-pin TSSOP
Applications
Structure
Absolute Maximum Ratings (Ta = 25°C)
• Bias voltage
• Control voltage
• Operating temperature
• Storage temperature
GaAs MMICs are ESD sensitive devices. Special handling precautions are required.
The actual ESD test data will be available later.
The CXG1104TN is a high power antenna switch
The CXG1104TN has on-chip logic, which enables
The Sony JFET process is used for low insertion
Cellular handsets, for example, narrow band CDMA and wide band CDMA
GaAs J-FET MMIC
High Power SPDT Switch with Logic Control
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
V
Topr
Tstg
Vctl
DD
–65 to +150
–35 to +85
7
5
– 1 –
°C
°C
V
V
CXG1104TN
10 pin TSSOP (Plastic)
E00X23A2Z-PS

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cxg1104tn Summary of contents

Page 1

... High Power SPDT Switch with Logic Control Description The CXG1104TN is a high power antenna switch MMIC for use in cellular handsets, for example, CDMA. The CXG1104TN has on-chip logic, which enables the switch circuit to operate by 1 CMOS control line. The Sony JFET process is used for low insertion loss and on-chip logic circuit ...

Page 2

... On Pass CTL RF1 – RF2 L RF1 – RF3 H DC Bias Condition Item Min. Typ. Vctl (H) 2.0 3.0 Vctl (L) 0 — V 2.6 3 (Ta = 25°C) Max. Unit 3.6 V 0.8 V 4.5 V – 2 – CXG1104TN V DD Cbypass (100pF) RF1 C (100pF) RF GND GND RF3 C (100pF) RF ...

Page 3

... IL 1.9GHz 900MHz ISO. 1.9GHz VSWR 900MHz, 1.9GHz 1 2fo 1 3fo P1dB V = 3.0V, 0/3V control DD 2 IIP3 TSW Vctl (High Ictl 3.0V, 0/3V control DD – 3 – CXG1104TN (Ta = 25°C) Min. Typ. Max. Unit 0.30 0.55 dB 0.40 0. 16.5 dB 1.2 1.4 — –60 –75 dBc –60 –75 dBc 32 35 ...

Page 4

... TSSOP (PLASTIC) 1.2MAX 2.8 ± 0 0.5 0.25 0˚ to 10˚ 0.1 M (0.2) + 0.08 0.22 – 0.07 DETAIL A PACKAGE STRUCTURE EPOXY RESIN PACKAGE MATERIAL TSSOP-10P-L01 LEAD TREATMENT SOLDER PLATING LEAD MATERIAL COPPER ALLOY 0.02g PACKAGE MASS ITEM SPEC. COPPER ALLOY Sn-Bi Bi:1-4wt% 5-18µm – 4 – CXG1104TN 0.1 + 0.15 0.1 – 0.05 0.1 + 0.15 0.1 – 0.05 Sony Corporation ...

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