cxg1189axr Sony Electronics, cxg1189axr Datasheet

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cxg1189axr

Manufacturer Part Number
cxg1189axr
Description
High Power Spdt Switch
Manufacturer
Sony Electronics
Datasheet

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Part Number:
CXG1189AXR
Manufacturer:
Anadigic
Quantity:
9 500
High Power SPDT Switch
Description
Features
Package
Structure
The CXG1189AXR is a high power SPDT (Single Pole Doble Throw) switch MMIC used in wireless
communication systems, for example, GSM handsets, GSM/UMTS dual mode handsets.
The Sony JPHEMT process is used for low insertion loss.
(Applications: Antenna switch for cellular handsets, GSM, GSM/UMTS dual mode)
Small package size: 12-pin XQFN
GaAs JPHEMT MMIC
This IC is ESD sensitive device. Special handling precautions are required.
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license
by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating
the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
Low insertion loss: 0.25dB@900MHz, 0.30dB@1.8GHz, 0.35dB@2.17GHz
Low harmonics level: –35dBm (Max.)
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CXG1189AXR
E06144

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cxg1189axr Summary of contents

Page 1

... High Power SPDT Switch Description The CXG1189AXR is a high power SPDT (Single Pole Doble Throw) switch MMIC used in wireless communication systems, for example, GSM handsets, GSM/UMTS dual mode handsets. The Sony JPHEMT process is used for low insertion loss. (Applications: Antenna switch for cellular handsets, GSM, GSM/UMTS dual mode) Features Low insertion loss: 0 ...

Page 2

Absolute Maximum Ratings ° ( Control voltage Input power max. [824 to 915MHz] Input power max. [1710 to 1910MHz] Input power max. [1920 to 1980MHz] Operating temperature Storage temperature Maximum power dissipation ・Copper-clad lamination of glass board ...

Page 3

Block Diagram and Recommended Circuit GND RF2 C RF GND When using this IC, the following external components should be used: Rctl: This resistor is used to improve ESD performance. 1kΩ is recommended C : This capacitor is used for ...

Page 4

Electrical Characteristics ° ( Item Symbol Insertion loss IL Isolation ISO. VSWR VSWR 2fo 3fo 2fo Harmonics *1 3fo 2fo 3fo P0.2dB compression P0.2dB input power Control current Ictl Electrical characteristics are measured with all RF ports ...

Page 5

Package Outline (Unit: mm) LEAD PLATING SPECIFICATIONS ITEM LEAD MATERIAL SOLDER COMPOSITION PLATING THICKNESS - 5 - SPEC. COPPER ALLOY Sn-Bi Bi:1-4wt% 5-18µm Sony Corporation ...

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