cxg1039tn Sony Electronics, cxg1039tn Datasheet
cxg1039tn
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cxg1039tn Summary of contents
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... High Isolation Absorptive SPDT Switch MMIC with Integrated Control Logic Description The CXG1039TN is a high isolation absorptive SPDT (Single Pole Dual Throw) switch MMIC used in PCS handsets. This IC is designed using the Sony’s GaAs J-FET process and operates with CMOS input. ...
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... RF1 C2 100pF 100pF When using the CXG1039TN, the following external components should be used: C1: This is used for signal line filtering. 100 pF is recommended. C2: This is used for RF De-coupling and must be used in all applications. 100 pF is recommended. Rctl: This is used to give improved ESD performance. ...
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... RF1 - RF2 ON L RF1 - RF3 ON Operating Condition Symbol Control voltage (High) Vctl (H) Control voltage (Low) Vctl (L) Bias voltage SW1 SW2 SW3 ON OFF OFF OFF ON ON Min. Typ. 2 2.7 DD —3— SW4 ON OFF (Ta=–35 °C to +85 °C) Max. Unit. 3 CXG1039TN ...
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... IP3 35 P1dB 12 TSW I DD ICRL Symbol Min. IL ISO 40 VSWR (ON) VSWR (OFF) ∗ 1 IP3 35 P1dB 12 TSW I DD ICRL —4— CXG1039TN (Ta=25 °C) Typ. Max. Unit 0.8 1 1.2 1.5 1.7 2.0 dBm 17 dBm 1 5 µs 220 350 µA 80 150 µA (Ta=–35 °C to +85 °C) Typ. Max. ...
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... LEAD MATERIAL COPPER ALLOY SOLDER COMPOSITION Sn-Bi Bi:1-4wt% PLATING THICKNESS 5-18µm —5— 1.2MAX 0.1 + 0.15 0.1 – 0.05 0.25 0° to 10° DETAIL A EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.02g 1.2MAX 0.1 + 0.15 0.1 – 0.05 0.25 0° to 10° DETAIL A EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.02g CXG1039TN Sony Corporation ...