cxg1224xr Sony Electronics, cxg1224xr Datasheet

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cxg1224xr

Manufacturer Part Number
cxg1224xr
Description
Sp4t+sp4t Antenna Switch For Gsm/umts
Manufacturer
Sony Electronics
Datasheet
Preliminary
SP4T+SP4T Antenna Switch for GSM/UMTS
Description
Features
Package
Structure
Absolute Maximum Ratings
The CXG1224XR is a high power SP4T+SP4T antenna switch for GSM/UMTS applications. The low insertion
loss on transmit means increased talk time as the Tx power amplifier can be operated at a lower output level.
On chip logic reduces component count and simplifies PCB layout by allowing direct connection of the switch
to digital baseband control lines with CMOS logic levels. It requires 3 CMOS control lines. The Sony GaAs
JPHEMT MMIC process is used for low insertion loss.
(Applications: GSM/UMTS dual-mode handsets)
Small and low height package size: 24-pin XQFN (2.7mm u 3.5mm u 0.4mm (Max.))
GaAs JPHEMT MMIC
(Ta = 25
This IC is ESD sensitive device. Special handling precautions are required.
The actual ESD test data will be availavle later.
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license
by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating
the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
Š Bias voltage
Š Control voltage
Š Input power max. (Tx1)
Š Input power max. (Tx2)
Š Input power max. (UMTS1, 2)
Š Input power max. (all_Rx)
Š Operating temperature
Š Storage temperature
Insertion loss (Tx1) 0.35dB (Typ.) @34dBm (GSM900)
q
C)
V
Vctl
DD
–65 to +150
–35 to +85
- 1 -
36
34
32
13
7
5
dBm
dBm
dBm
dBm
Preliminary
CXG1224XR
q
q
V
V
C
C
(Duty cycle = 12.5 to 50%)
(Duty cycle = 12.5 to 50%)
PE05Y46-PS

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cxg1224xr Summary of contents

Page 1

... Preliminary Description The CXG1224XR is a high power SP4T+SP4T antenna switch for GSM/UMTS applications. The low insertion loss on transmit means increased talk time as the Tx power amplifier can be operated at a lower output level. On chip logic reduces component count and simplifies PCB layout by allowing direct connection of the switch to digital baseband control lines with CMOS logic levels ...

Page 2

... Rx2 Rx3 Rx4 Ant1 F3 F10 Tx1 F1 F4 F11 F7 F14 Ant2 F5 F12 F9 Tx2 F2 F6 F13 F14 CXG1224XR Rx1 (GSM850) Rx2 (GSM900) Rx3 (GSM1800) Rx4 (GSM1900) 7 GND 6 UMTS1 5 GND 4 UMTS2 GND 3 Ant2 2 1 GND ...

Page 3

... OFF OFF OFF OFF OFF OFF ON ON OFF OFF OFF OFF OFF OFF ON ON Typ. Max. Unit 2.8 3.6 — 0.4 V 2.8 3 CXG1224XR F9 F10 F11 F12 F13 F14 OFF OFF OFF OFF OFF ...

Page 4

... Ant2 – Rx3 *3 Ant2 – Rx4 Ant2 – UMTS2 Ant2 – Tx2 Ant2 – Rx3 *10 , *11 Ant2 – Rx4 Tx2 – Rx3 *3 Tx2 – Rx4 UMTS2 – Rx3 *10 , *11 UMTS2 – Rx4 All ports in active 824 to 2170MHz paths - 4 - CXG1224XR Min. Typ. Max. Unit 0.35 0.50 0.50 0.65 0.50 0.65 0.38 0.53 0.38 0.53 dB 0.47 0.62 0.70 0.85 0.65 0.80 ...

Page 5

... Tx2 enabled DD = 2.8V, Rx1 or Rx2 enabled DD = 2.8V, Rx1 or Rx2 enabled DD = 2.8V, Rx3 or Rx4 enabled DD = 2.8V, Rx3 or Rx4 enabled DD = 2.8V, UMTS1 enabled DD = 2.8V, UMTS1 enabled DD = 2.8V, UMTS2 enabled DD = 2.8V, UMTS2 enabled CXG1224XR Typ. Max. Unit –33 –30 –30 –27 –47 –44 –49 –46 dBm –34 –31 –32 –28 –43 –40 – ...

Page 6

... Cbypass (100pF) Cbypass (100pF) Cbypass (100pF) Cbypass (100pF CXG1224XR UMTS1 C RF (56pF) UMTS2 C RF (33pF) Ant2 C RF (33pF) CTLC Rctl (1kΩ) CTLB Rctl (1kΩ) CTLA Rctl (1kΩ) ...

Page 7

... A 8 0.18 S Solder Plating + 0.09 0.14 – 0.03 TERMINAL SECTION PACKAGE STRUCTURE PACKAGE MATERIAL LEAD TREATMENT XQFN-24P-01 LEAD MATERIAL PACKAGE MASS LEAD PLATING SPECIFICATIONS ITEM LEAD MATERIAL SOLDER COMPOSITION PLATING THICKNESS - 7 - CXG1224XR 0.05 S A-B C 0.4 ± 0 0.4 0.07 0. 0.09 0.25 – 0.03 EPOXY RESIN SOLDER PLATING COPPER ALLOY ...

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