MSB710-QT1 MOTOROLA [Motorola, Inc], MSB710-QT1 Datasheet

no-image

MSB710-QT1

Manufacturer Part Number
MSB710-QT1
Description
PNP General Purpose Amplifier Transistors Surface Mount
Manufacturer
MOTOROLA [Motorola, Inc]
Datasheet
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
PNP General Purpose Amplifier
Transistors Surface Mount
Thermal Clad is a trademark of the Bergquist Company
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 1
MAXIMUM RATINGS
THERMAL CHARACTERISTICS
DEVICE MARKING
The “X” represents a smaller alpha digit Date Code. The Date Code indicates the actual month
in which the part was manufactured.
Motorola Small–Signal Transistors, FETs and Diodes Device Data
Motorola, Inc. 1996
Collector–Base Voltage
Collector–Emitter Voltage
Emitter–Base Voltage
Collector Current — Continuous
Collector Current — Peak
Power Dissipation
Junction Temperature
Storage Temperature
CQ
MSB710–QT1
X
(T A = 25 C)
Characteristic
Rating
Marking Symbol
MSB710–RT1
CR
BASE
2
COLLECTOR
X
3
V (BR)CBO
V (BR)CEO
V (BR)EBO
Symbol
Symbol
EMITTER
I C(P)
T stg
P D
T J
I C
1
MSB710-QT1
MSB710-RT1
– 55 ~ +150
CASE 318D–03, STYLE 1
Value
– 500
– 7.0
–1.0
Max
– 60
– 50
200
150
*Motorola Preferred Device
2
SC–59
1
Order this document
by MSB710–QT1/D
3
mAdc
Unit
Unit
mW
Vdc
Vdc
Vdc
Adc
C
C
*
1

Related parts for MSB710-QT1

MSB710-QT1 Summary of contents

Page 1

... Thermal Clad is a trademark of the Bergquist Company Preferred devices are Motorola recommended choices for future use and best overall value. REV 1 Motorola Small–Signal Transistors, FETs and Diodes Device Data Motorola, Inc. 1996 MSB710-QT1 MSB710-RT1 *Motorola Preferred Device COLLECTOR CASE 318D– ...

Page 2

... MSB710-QT1 MSB710-RT1 ELECTRICAL CHARACTERISTICS ( Characteristic Collector–Emitter Breakdown Voltage ( –10 mAdc Collector–Base Breakdown Voltage ( –10 Adc Emitter–Base Breakdown Voltage ( –10 Adc Collector–Base Cutoff Current ( –20 Vdc Current Gain ( – ...

Page 3

... Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. MSB710-QT1 MSB710-RT1 150 C – 200 milliwatts 625 C/W 3 ...

Page 4

... MSB710-QT1 MSB710-RT1 Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste onto the footprint. The stencil is made of brass For any given circuit board, there will be a group of control settings that will give the desired heat pattern ...

Page 5

... H Motorola Small–Signal Transistors, FETs and Diodes Device Data PACKAGE DIMENSIONS NOTES CASE 318D–03 ISSUE E SC–59 MSB710-QT1 MSB710-RT1 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. MILLIMETERS INCHES DIM MIN MAX MIN MAX A 2.70 3.10 0.1063 ...

Page 6

... MSB710-QT1 MSB710-RT1 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “ ...

Related keywords