CLD-DS41 CREE [Cree, Inc], CLD-DS41 Datasheet - Page 5

• Manufacturer Part Number: CLD-DS41
• Manufacturer: CREE [Cree, Inc]

Thermal Design (This Is XP-E HEW Data - which is the right data….)
Typical Spatial Distribution
tyPical sPatial distriBution
thermal desiGn
The maximum forward current is determined by the thermal resistance between the LeD junction and ambient. it is
crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to
ambient in order to optimize lamp life and optical characteristics.
Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks
Copyright © 2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks
of Cree, Inc.
of Cree, Inc.
1200
1000
800
600
400
200
0
-100
0
Rj-a = 10°C/W
Rj-a = 15°C/W
Rj-a = 20°C/W
Rj-a = 25°C/W
-80
20
-60
-40
40
Ambient Temperature (ºC)
-20
1.00
0.80
0.60
0.40
0.20
0.00
Angle (º)
60
0
20
80
40
100
60
xlamp xT-E Royal BluE lEDs
80
120
100
140
5
5