ECG099B WJCI [WJ Communication. Inc.], ECG099B Datasheet - Page 6

• Manufacturer Part Number: ECG099B
• Manufacturer: WJCI [WJ Communication. Inc.]

Thermal Specifications
1. The thermal resistance is referenced from the hottest
2. This corresponds to the typical biasing condition of
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: [phone] • e-mail: [e-mail] • Web site: www.wj.com
Notes:
Parameter
Operating Case Temperature
Thermal Resistance
Junction Temperature
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260°C reflow temperature) and leaded
part of the junction to the ground tab (pin 4).
+5V, 160 mA at an 85° C ground tab temperature.
A minimum MTTF of 1 million hours is achieved
for junction temperatures below 247° C.
AH118-89G (Green / Lead-free SOT-89 Package) Mechanical Information
AH118 / ECG099
¼ Watt, High Linearity InGaP HBT Amplifier
(maximum 245°C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
(1)
(2)
Outline Drawing
Land Pattern
Rating
-40 to +85° C
92° C / W
159° C
100000
10000
1000
100
60
MTTF vs. GND Tab Temperature
70
Tab Temperature (°C)
80
90
100
110
120
The Communications Edge
Specifications and information are subject to change without notice
The component will be marked with an
“AH118G” designator with an alphanumeric
lot code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD Rating: Class 1A
Value:
Test:
Standard:
MSL Rating: Level 3 at +260° C convection reflow
Standard:
1. Ground / thermal vias are critical for the proper
2. Add as much copper as possible to inner and outer
3. Mounting screws can be added near the part to fasten
4. Do not put solder mask on the backside of the PC board
5. RF trace width depends upon the PC board material
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
Mounting Config. Notes
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
layers near the part to ensure optimal thermal
performance.
the board to a heatsink.
thermal via region contacts the heatsink.
in the region where the board contacts the heatsink.
and construction.
in degrees.
MSL / ESD Rating
Product Marking
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
JEDEC Standard J-STD-020
Product Information
Ensure that the ground /
Page 6 of 7
TM
June 2005