ADN2526ACPZ-R2 AD [Analog Devices], ADN2526ACPZ-R2 Datasheet - Page 10

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ADN2526ACPZ-R2

Manufacturer Part Number
ADN2526ACPZ-R2
Description
11.3 Gbps Active Back-Termination, Differential Laser Diode Driver
Manufacturer
AD [Analog Devices]
Datasheet
ADN2526
THEORY OF OPERATION
As shown in Figure 1, the ADN2526 consists of an input stage
and two voltage-controlled current sources for bias and modula-
tion. The bias current, which is available at the IBIAS pin, is
controlled by the voltage applied at the BSET pin and can be
monitored at the IBMON pin. The differential modulation
current, which is available at the IMODP and IMODN pins, is
controlled by the voltage applied to the MSET pin. The output
stage implements the active back-match circuitry for proper
transmission line matching and power consumption reduction.
The ADN2526 can drive a load having differential resistance
ranging from 5 Ω to 50 Ω. The excellent back-termination in
the ADN2526 absorbs the signal reflections from the TOSA
end, enabling excellent optical eye quality, even though the
TOSA is significantly misterminated.
INPUT STAGE
The input stage of the ADN2526 converts the data signal applied
to the DATAP and DATAN pins to a level that ensures proper
operation of the high speed switch. The equivalent circuit of the
input stage is shown in Figure 17.
The DATAP and DATAN pins are terminated internally with a
100 Ω differential termination resistor. This minimizes signal
reflections at the input, which can otherwise lead to degradation in
the output eye diagram. It is not recommended to drive the
ADN2526 with single-ended data signal sources.
The ADN2526 input stage must be ac-coupled to the signal
source to eliminate the need for matching between the common-
mode voltages of the data signal source and the input stage of
the driver (see Figure 18). The ac-coupling capacitors should
have an impedance much less than 50 Ω over the required
frequency range. Generally, this is achieved using 10 nF to 100 nF
capacitors.
In SFP+ MSA applications, the DATAP and DATAN pins need
to be connected to the SFP+ connector directly. This connection
requires enhanced ESD protection to support the SFP+ module
hot plug-in application.
DATAN
DATAP
Figure 17. Equivalent Circuit of the Input Stage
VCC
50Ω
50Ω
VCC
Rev. A | Page 10 of 16
BIAS CURRENT
The bias current is generated internally using a voltage-to-current
converter consisting of an internal operational amplifier and a
transistor, as shown in Figure 19.
The voltage-to-current conversion factor is set at 100 mA/V by
the internal resistors, and the bias current is monitored using a
current mirror with a gain equal to 1/100. By connecting a 1 kΩ
resistor between IBMON and VEE, the bias current can be moni-
tored as a voltage across the resistor. A low temperature coefficient
precision resistor must be used for the IBMON resistor (R
Any error in the value of R
in its value over temperature contributes to the overall error
budget for the IBIAS monitor voltage. If the IBMON voltage is
connected to an ADC for analog-to-digital conversion, R
should be placed close to the ADC to minimize errors due to
voltage drops on the ground plane.
The equivalent circuits of the BSET, IBIAS, and IBMON pins
are shown in Figure 20, Figure 21, and Figure 22.
Figure 18. AC-Coupling the Data Source to the ADN2526 Data Inputs
Figure 19. Voltage-to-Current Converter Used to Generate IBIAS
DATA SIGNAL SOURCE
BSET
50Ω
BSET
Figure 20. Equivalent Circuit of the BSET Pin
ADN2526
200Ω
800Ω
50Ω
VCC
GND
IBMON
R
800Ω
200Ω
that is due to tolerances or to drift
200Ω
C
C
VCC
R
VCC
2Ω
DATAP
DATAN
I
I
BMON
BIAS
ADN2526
IBMON
IBIAS
IBMON
IBMON
).

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