LT6200-5 LINER [Linear Technology], LT6200-5 Datasheet - Page 23

• Manufacturer Part Number: LT6200-5
• Description: 165MHz, Rail-to-Rail Input and Output, 0.95nV/?Hz Low Noise, Op Amp Family
• Manufacturer: LINER [Linear Technology]

PACKAGE DESCRIPTION
3.5 0.05
2.10 0.05
3.85 MAX
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
0.20 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
1.65 0.05
(2 SIDES)
0.25 0.05
2.62 REF
DATUM ‘A’
RECOMMENDED SOLDER PAD LAYOUT
0.62
MAX
PER IPC CALCULATOR
2.38 0.05
0.50
BSC
0.30 – 0.50 REF
0.95
REF
1.22 REF
0.70 0.05
1.4 MIN
PACKAGE
OUTLINE
(Reference LTC DWG # 05-08-1698 Rev C)
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1636)
TOP MARK
6-Lead Plastic TSOT-23
(NOTE 6)
0.09 – 0.20
(NOTE 3)
PIN 1
0.200 REF
2.80 BSC
S6 Package
DD Package
1.00 MAX
1.50 – 1.75
(NOTE 4)
0.80 – 0.90
0.95 BSC
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
0.75 0.05
3.00 0.10
(4 SIDES)
PIN ONE ID
0.00 – 0.05
2.90 BSC
(NOTE 4)
1.90 BSC
LT6200-10/LT6201
1.65 0.10
(2 SIDES)
LT6200/LT6200-5
BOTTOM VIEW—EXPOSED PAD
0.25 0.05
R = 0.125
TYP
4
5
2.38 0.10
S6 TSOT-23 0302 REV B
0.01 – 0.10
0.30 – 0.45
6 PLCS (NOTE 3)
8
1
0.50 BSC
0.40 0.10
(DD8) DFN 0509 REV C
23
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