NBB-502-E RFMD [RF Micro Devices], NBB-502-E Datasheet - Page 4

• Manufacturer Part Number: NBB-502-E
• Description: CASCADABLE BROADBAND GaAs MMIC AMPLIFIER DC TO 4GHz
• Manufacturer: RFMD [RF Micro Devices]

Die Attach
The die attach process mechanically attaches the die to the circuit substrate. In addition, it electrically connects the
ground to the trace on which the chip is mounted, and establishes the thermal path by which heat can leave the chip.
Wire Bonding
Electrical connections to the chip are made through wire bonds. Either wedge or ball bonding methods are acceptable
practices for wire bonding.
Assembly Procedure
Epoxy or eutectic die attach are both acceptable attachment methods. Top and bottom metallization are gold. Conductive
silver-filled epoxies are recommended. This procedure involves the use of epoxy to form a joint between the backside
gold of the chip and the metallized area of the substrate. A 150°C cure for 1 hour is necessary. Recommended epoxy is
Ablebond 84-1LMI from Ablestik.
Bonding Temperature (Wedge or Ball)
It is recommended that the heater block temperature be set to 160°C±10°C.
4-60
Recommended Bias Resistor Values
Supply Voltage, V
Bias Resistor, R
NBB-502
Application notes related to biasing circuit, device footprint, and thermal considerations are available on request.
CC
CC
(Ω)
(V)
31
5
In
Typical Bias Configuration
117
C block
8
Application Notes
4
174
10
5,6,7,9
1,2,3
8
231
12
V
DEVICE
V
V
L choke
(optional)
CC
R
D
C block
CC
= 3.9 V
317
15
Out
460
20
Rev A5 060124