LTC2634-HMI10 LINER [Linear Technology], LTC2634-HMI10 Datasheet - Page 28

• Manufacturer Part Number: LTC2634-HMI10
• Manufacturer: LINER [Linear Technology]

LTC2634
PACKAGE DESCRIPTION
28
(.0120 .0015)
0.305 0.038
TYP
GAUGE PLANE
(.206)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
5.23
MIN
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
(.007)
RECOMMENDED SOLDER PAD LAYOUT
0.18
(.010)
2.794 0.102
0.254
(.110 .004)
DETAIL “A”
DETAIL “A”
0 – 6 TYP
(.0197)
2.083 0.102
(.082 .004)
0.50
BSC
10-Lead Plastic MSOP , Exposed Die Pad
(Reference LTC DWG # 05-08-1664 Rev C)
(.021 .006)
0.53 0.152
SEATING
0.889 0.127
(.035 .005)
(.126 – .136)
PLANE
3.20 – 3.45
MSE Package
(.118 .004)
3.00 0.102
(.007 – .011)
(.193 .006)
4.90 0.152
0.17 – 0.27
(NOTE 3)
TYP
(.043)
MAX
1.10
EXPOSED PAD OPTION
BOTTOM VIEW OF
(.0197)
0.50
BSC
10
10
1
1 2 3 4 5
9
8
7 6
DETAIL “B”
(.081 .004)
2.06 0.102
(.072 .004)
(.118 .004)
1.83 0.102
3.00 0.102
(.0196 .003)
0.497 0.076
(.034)
(NOTE 4)
0.86
REF
0.1016 0.0508
MSOP (MSE) 0908 REV C
(.004 .002)
REF
NO MEASUREMENT PURPOSE
THE LEADFRAME FEATURE.
CORNER TAIL IS PART OF
FOR REFERENCE ONLY
DETAIL “B”
0.05 REF
0.29
REF
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